您好,欢迎来到双灏业商城!
    双灏业商城0755-83179664

    IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    02-1518-10H

    02-1518-10H

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    1,454
    02-1518-10H

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-1518-10T

    02-1518-10T

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    2,684
    02-1518-10T

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    AR 10 HGL-TT

    AR 10 HGL-TT

    SOCKET

    Assmann WSW Components

    4,057
    AR 10 HGL-TT

    规格书

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR14-HZL-TT

    AR14-HZL-TT

    CONN IC DIP SOCKET 14POS TIN

    Assmann WSW Components

    3,235
    AR14-HZL-TT

    规格书

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    232-44

    232-44

    CONN SOCKET PLCC 44POS TIN

    CNC Tech

    3,002
    232-44

    规格书

    - Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 105°C
    110-87-308-41-005101

    110-87-308-41-005101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    4,307
    110-87-308-41-005101

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X04-160B

    SIP050-1X04-160B

    1X04-160B-SIP SOCKET 4 CTS

    Amphenol ICC (FCI)

    3,528
    SIP050-1X04-160B

    规格书

    SIP050-1x Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    AW 127-17/Z-T

    AW 127-17/Z-T

    SOCKET 17 CONTACTS SINGLE ROW

    Assmann WSW Components

    3,721
    AW 127-17/Z-T

    规格书

    - - Active - - - - - - - - - - - - - - -
    AR14-HZL/07-TT

    AR14-HZL/07-TT

    CONN IC DIP SOCKET 14POS GOLD

    Assmann WSW Components

    3,023
    AR14-HZL/07-TT

    规格书

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    A22-LC-TT

    A22-LC-TT

    CONN IC DIP SOCKET 6POS TIN

    Assmann WSW Components

    2,951
    A22-LC-TT

    规格书

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    115-87-306-41-003101

    115-87-306-41-003101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,688
    115-87-306-41-003101

    规格书

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1-1825093-1

    1-1825093-1

    CONN IC DIP SOCKET 6POS GOLD

    TE Connectivity AMP Connectors

    1,587
    1-1825093-1

    规格书

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    01-0513-10H

    01-0513-10H

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    4,873
    01-0513-10H

    规格书

    0513 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-0513-10

    02-0513-10

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    2,603
    02-0513-10

    规格书

    0513 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-304-41-012101

    116-87-304-41-012101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    1,395
    116-87-304-41-012101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A28-LC-7-TT-R

    A28-LC-7-TT-R

    CONN IC DIP SOCKET 28POS TIN

    Assmann WSW Components

    2,166
    A28-LC-7-TT-R

    规格书

    - Box Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    HLS-2001-TT-11

    HLS-2001-TT-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,648
    HLS-2001-TT-11

    规格书

    HLS Bulk Active SIP 20 (20 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    4-1814655-7

    4-1814655-7

    CONN SOCKET SIP 5POS GOLD

    TE Connectivity AMP Connectors

    4,742
    4-1814655-7

    规格书

    - Bulk Obsolete SIP 5 (1 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
    AW 127-18/Z-T

    AW 127-18/Z-T

    SOCKET 18 CONTACTS SINGLE ROW

    Assmann WSW Components

    1,768
    AW 127-18/Z-T

    规格书

    - - Active - - - - - - - - - - - - - - -
    SIP050-1X05-157B

    SIP050-1X05-157B

    1X05-157B-SIP SOCKET 5 CTS

    Amphenol ICC (FCI)

    1,612
    SIP050-1X05-157B

    规格书

    SIP050-1x Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    联系我们 获取更多产品资讯!
    双灏业商城

    首页

    双灏业商城

    产品中心

    双灏业商城

    电话

    双灏业商城

    会员中心

    品种齐全,轻松购物
    品种齐全,轻松购物
    多仓直发,极速配送
    多仓直发,极速配送
    正品行货,精致服务
    正品行货,精致服务
    天天低价,畅选无忧
    天天低价,畅选无忧
    版权所有©2025 双灏业商城