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    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-0238-G-T

    APH-0238-G-T

    APH-0238-G-T

    Samtec Inc.

    1,352
    APH-0238-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0638-G-T

    APH-0638-G-T

    APH-0638-G-T

    Samtec Inc.

    1,701
    APH-0638-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1138-G-T

    APH-1138-G-T

    APH-1138-G-T

    Samtec Inc.

    3,448
    APH-1138-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0338-G-T

    APH-0338-G-T

    APH-0338-G-T

    Samtec Inc.

    3,137
    APH-0338-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0738-G-T

    APH-0738-G-T

    APH-0738-G-T

    Samtec Inc.

    4,344
    APH-0738-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    50-9503-21

    50-9503-21

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    3,307
    50-9503-21

    规格书

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    50-9503-31

    50-9503-31

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    2,504
    50-9503-31

    规格书

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    510-93-149-15-061003

    510-93-149-15-061003

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    1,598
    510-93-149-15-061003

    规格书

    510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-43-630-10-002000

    299-43-630-10-002000

    CONN IC DIP SOCKET 30POS GOLD

    Mill-Max Manufacturing Corp.

    1,030
    299-43-630-10-002000

    规格书

    299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-1828-G-R

    APH-1828-G-R

    APH-1828-G-R

    Samtec Inc.

    3,479
    APH-1828-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0928-G-R

    APH-0928-G-R

    APH-0928-G-R

    Samtec Inc.

    3,604
    APH-0928-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1928-G-R

    APH-1928-G-R

    APH-1928-G-R

    Samtec Inc.

    2,580
    APH-1928-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1028-G-R

    APH-1028-G-R

    APH-1028-G-R

    Samtec Inc.

    1,091
    APH-1028-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1628-G-R

    APH-1628-G-R

    APH-1628-G-R

    Samtec Inc.

    4,714
    APH-1628-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1728-G-R

    APH-1728-G-R

    APH-1728-G-R

    Samtec Inc.

    3,298
    APH-1728-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    48-3574-11

    48-3574-11

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    1,349
    48-3574-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    HLS-0513-G-38

    HLS-0513-G-38

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,853
    HLS-0513-G-38

    规格书

    HLS Bulk Active SIP 65 (5 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    510-13-089-12-051001

    510-13-089-12-051001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    2,217
    510-13-089-12-051001

    规格书

    510 Bulk Active PGA 89 (12 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-93-153-15-061001

    510-93-153-15-061001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    2,525
    510-93-153-15-061001

    规格书

    510 Bulk Active PGA 153 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-640-61-801000

    110-13-640-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,977
    110-13-640-61-801000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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