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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-1736-G-T

    APH-1736-G-T

    APH-1736-G-T

    Samtec Inc.

    3,817
    APH-1736-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APA-648-G-P

    APA-648-G-P

    ADAPTER PLUG

    Samtec Inc.

    3,838
    APA-648-G-P

    规格书

    APA Tube Active - 48 (2 x 24) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    40-3570-11

    40-3570-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    2,738
    40-3570-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3571-11

    40-3571-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    1,176
    40-3571-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3573-11

    40-3573-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    4,669
    40-3573-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3575-11

    40-3575-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    2,815
    40-3575-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6574-11

    40-6574-11

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    3,069
    40-6574-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3574-11

    40-3574-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    1,903
    40-3574-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6573-11

    40-6573-11

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    3,305
    40-6573-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    116-93-650-61-001000

    116-93-650-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,818
    116-93-650-61-001000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0910-G-2

    HLS-0910-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,174
    HLS-0910-G-2

    规格书

    HLS Bulk Active SIP 90 (9 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    514-83-257-20-111117

    514-83-257-20-111117

    CONN SOCKET PGA 257POS GOLD

    Preci-Dip

    4,416
    514-83-257-20-111117

    规格书

    514 Bulk Active PGA 257 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    517-83-447-20-121111

    517-83-447-20-121111

    CONN SOCKET PGA 447POS GOLD

    Preci-Dip

    2,561
    517-83-447-20-121111

    规格书

    517 Bulk Active PGA 447 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APO-640-G-B

    APO-640-G-B

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,557
    APO-640-G-B

    规格书

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-43-964-61-003000

    116-43-964-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,102
    116-43-964-61-003000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-964-61-003000

    116-93-964-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,839
    116-93-964-61-003000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    88-PGM13028-10H

    88-PGM13028-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    1,891
    88-PGM13028-10H

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    614-87-279-19-081112

    614-87-279-19-081112

    CONN SOCKET PGA 279POS GOLD

    Preci-Dip

    4,936
    614-87-279-19-081112

    规格书

    614 Bulk Active PGA 279 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APH-0528-G-H

    APH-0528-G-H

    APH-0528-G-H

    Samtec Inc.

    2,007
    APH-0528-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1628-G-H

    APH-1628-G-H

    APH-1628-G-H

    Samtec Inc.

    2,231
    APH-1628-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
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