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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    50-9508-31

    50-9508-31

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    3,729
    50-9508-31

    规格书

    508 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    514-83-360M19-001148

    514-83-360M19-001148

    CONN SOCKET BGA 360POS GOLD

    Preci-Dip

    4,386
    514-83-360M19-001148

    规格书

    514 Bulk Active BGA 360 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-3575-16

    28-3575-16

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    1,745
    28-3575-16

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-6575-16

    28-6575-16

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    2,565
    28-6575-16

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    224-PGM15038-11H

    224-PGM15038-11H

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,591
    224-PGM15038-11H

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    225-PGM15001-11

    225-PGM15001-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,261
    225-PGM15001-11

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    68-PGM11032-10T

    68-PGM11032-10T

    CONN SOCKET PGA TIN

    Aries Electronics

    4,532
    68-PGM11032-10T

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-1212-G-2

    HLS-1212-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,879
    HLS-1212-G-2

    规格书

    HLS Bulk Active SIP 144 (12 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    546-87-503-22-131147

    546-87-503-22-131147

    CONN SOCKET PGA 503POS GOLD

    Preci-Dip

    1,801
    546-87-503-22-131147

    规格书

    546 Bulk Active PGA 503 (22 x 22) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-87-529-21-121147

    546-87-529-21-121147

    CONN SOCKET PGA 529POS GOLD

    Preci-Dip

    1,365
    546-87-529-21-121147

    规格书

    546 Bulk Active PGA 529 (21 x 21) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    514-87-478M26-131148

    514-87-478M26-131148

    CONN SOCKET BGA 478POS GOLD

    Preci-Dip

    4,425
    514-87-478M26-131148

    规格书

    514 Bulk Active BGA 478 (26 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    550-10-500M30-001166

    550-10-500M30-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    1,031
    550-10-500M30-001166

    规格书

    550 Bulk Active BGA 500 (30 x 30) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    514-87-480M29-001148

    514-87-480M29-001148

    CONN SOCKET BGA 480POS GOLD

    Preci-Dip

    2,880
    514-87-480M29-001148

    规格书

    514 Bulk Active BGA 480 (29 x 29) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    232-PGM17037-11

    232-PGM17037-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,306
    232-PGM17037-11

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    550-10-296-19-131135

    550-10-296-19-131135

    PGA SOLDER TAIL

    Preci-Dip

    1,890
    550-10-296-19-131135

    规格书

    550 Bulk Active PGA 296 (19 x 19) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    550-10-504M29-001166

    550-10-504M29-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    1,535
    550-10-504M29-001166

    规格书

    550 Bulk Active BGA 504 (29 x 29) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    114-PGM13040-51

    114-PGM13040-51

    CONN SOCKET PGA GOLD

    Aries Electronics

    1,004
    114-PGM13040-51

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    HLS-0516-G-38

    HLS-0516-G-38

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,415
    HLS-0516-G-38

    规格书

    HLS Bulk Active SIP 80 (5 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    550-10-352M26-001152

    550-10-352M26-001152

    BGA SOLDER TAIL

    Preci-Dip

    1,064
    550-10-352M26-001152

    规格书

    550 Bulk Active BGA 352 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    546-83-403-19-111147

    546-83-403-19-111147

    CONN SOCKET PGA 403POS GOLD

    Preci-Dip

    2,076
    546-83-403-19-111147

    规格书

    546 Bulk Active PGA 403 (19 x 19) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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