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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    24-3554-16

    24-3554-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    2,377
    24-3554-16

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    614-87-320-19-131144

    614-87-320-19-131144

    CONN SOCKET PGA 320POS GOLD

    Preci-Dip

    3,785
    614-87-320-19-131144

    规格书

    614 Bulk Active PGA 320 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-321-19-121144

    614-87-321-19-121144

    CONN SOCKET PGA 321POS GOLD

    Preci-Dip

    2,792
    614-87-321-19-121144

    规格书

    614 Bulk Active PGA 321 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    550-10-456M26-001166

    550-10-456M26-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    1,608
    550-10-456M26-001166

    规格书

    550 Bulk Active BGA 456 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    APH-1940-G-R

    APH-1940-G-R

    APH-1940-G-R

    Samtec Inc.

    2,666
    APH-1940-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0340-G-R

    APH-0340-G-R

    APH-0340-G-R

    Samtec Inc.

    3,504
    APH-0340-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1640-G-R

    APH-1640-G-R

    APH-1640-G-R

    Samtec Inc.

    4,521
    APH-1640-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    614-87-325-18-111144

    614-87-325-18-111144

    CONN SOCKET PGA 325POS GOLD

    Preci-Dip

    3,095
    614-87-325-18-111144

    规格书

    614 Bulk Active PGA 325 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-87-296-19-131147

    546-87-296-19-131147

    CONN SOCKET PGA 296POS GOLD

    Preci-Dip

    4,913
    546-87-296-19-131147

    规格书

    546 Bulk Active PGA 296 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-83-391-18-101147

    546-83-391-18-101147

    CONN SOCKET PGA 391POS GOLD

    Preci-Dip

    2,281
    546-83-391-18-101147

    规格书

    546 Bulk Active PGA 391 (18 x 18) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-6554-16

    28-6554-16

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    3,664
    28-6554-16

    规格书

    55 Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-6552-16

    28-6552-16

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    2,479
    28-6552-16

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-3554-16

    28-3554-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    4,404
    28-3554-16

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 250°C
    558-10-292M20-001104

    558-10-292M20-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    1,583
    558-10-292M20-001104

    规格书

    558 Bulk Active BGA 292 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    224-5809-50-0602

    224-5809-50-0602

    3M TEXTOOL ZIP STRIP SOCKETS 224

    3M

    1,705
    224-5809-50-0602

    规格书

    Textool™ Box Active SIP, ZIF (ZIP) 24 (1 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    APA-648-G-B

    APA-648-G-B

    ADAPTER PLUG

    Samtec Inc.

    2,774
    APA-648-G-B

    规格书

    APA Bulk Active - 48 (2 x 24) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    239-5605-01-0602

    239-5605-01-0602

    CONN ZIG-ZAG 39POS GOLD

    3M

    3,755
    239-5605-01-0602

    规格书

    - Bulk Obsolete Zig-Zag 39 (1 x 19, 1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 150°C
    232-2601-50-0602

    232-2601-50-0602

    IN-LINE ZIP STRIP POCKETS 32 CON

    3M

    1,454
    232-2601-50-0602

    规格书

    - Bulk Active - - - - - - - - - - - - - - -
    518-77-292M20-001105

    518-77-292M20-001105

    CONN SOCKET PGA 292POS GOLD

    Preci-Dip

    3,004
    518-77-292M20-001105

    规格书

    518 Bulk Active PGA 292 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    517-83-685-19-000111

    517-83-685-19-000111

    CONN SOCKET PGA 685POS GOLD

    Preci-Dip

    1,660
    517-83-685-19-000111

    规格书

    517 Bulk Active PGA 685 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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