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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    518-77-432M31-001105

    518-77-432M31-001105

    CONN SOCKET PGA 432POS GOLD

    Preci-Dip

    3,406
    518-77-432M31-001105

    规格书

    518 Bulk Active PGA 432 (31 x 31) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    68-536-11

    68-536-11

    CONN SOCKET PLCC ZIF 68POS GOLD

    Aries Electronics

    2,849
    68-536-11

    规格书

    536 - Obsolete PLCC, ZIF (ZIP) 68 (4 x 17) 0.050" (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - - -
    36-3571-16

    36-3571-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    3,024
    36-3571-16

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    36-3572-16

    36-3572-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    1,574
    36-3572-16

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    36-3573-16

    36-3573-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    1,798
    36-3573-16

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    36-3574-16

    36-3574-16

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    3,271
    36-3574-16

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-3575-16

    36-3575-16

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    1,958
    36-3575-16

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6571-16

    36-6571-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    2,980
    36-6571-16

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    36-6573-16

    36-6573-16

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    4,027
    36-6573-16

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6574-16

    36-6574-16

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    2,197
    36-6574-16

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6575-16

    36-6575-16

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    1,901
    36-6575-16

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    514-83-520M31-001148

    514-83-520M31-001148

    CONN SOCKET BGA 520POS GOLD

    Preci-Dip

    1,916
    514-83-520M31-001148

    规格书

    514 Bulk Active BGA 520 (31 x 31) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    101-PRS13022-12

    101-PRS13022-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,879
    101-PRS13022-12

    规格书

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    101-PRS13023-12

    101-PRS13023-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,645
    101-PRS13023-12

    规格书

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    HLS-1717-T-22

    HLS-1717-T-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,591
    HLS-1717-T-22

    规格书

    HLS Bulk Active SIP 289 (17 x 17) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    30-PLS16017-12

    30-PLS16017-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,019
    30-PLS16017-12

    规格书

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    30-PLS16018-12

    30-PLS16018-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,323
    30-PLS16018-12

    规格书

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    30-PLS16020-12

    30-PLS16020-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,559
    30-PLS16020-12

    规格书

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    30-PLS16022-12

    30-PLS16022-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,825
    30-PLS16022-12

    规格书

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    30-PRS16017-12

    30-PRS16017-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,451
    30-PRS16017-12

    规格书

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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