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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    7010321946

    7010321946

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    2,012
    7010321946

    规格书

    - Bulk Active - - - - - - - - - - - - - - -
    558-10-420M26-001101

    558-10-420M26-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    4,594
    558-10-420M26-001101

    规格书

    558 Bulk Active PGA 420 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    42-6556-41

    42-6556-41

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    3,937
    42-6556-41

    规格书

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    518-77-388M26-001106

    518-77-388M26-001106

    CONN SOCKET PGA 388POS GOLD

    Preci-Dip

    4,903
    518-77-388M26-001106

    规格书

    518 Bulk Active PGA 388 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    514-83-478M26-131148

    514-83-478M26-131148

    CONN SOCKET BGA 478POS GOLD

    Preci-Dip

    3,706
    514-83-478M26-131148

    规格书

    514 Bulk Active BGA 478 (26 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    558-10-400M20-000104

    558-10-400M20-000104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    2,819
    558-10-400M20-000104

    规格书

    558 Bulk Active BGA 400 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    223-33-320-41-001000

    223-33-320-41-001000

    STANDARD WIRE WRAP DIP SOCKET

    Mill-Max Manufacturing Corp.

    1,980
    223-33-320-41-001000

    规格书

    - Tube Active - - - - - - - - - - - - - - -
    514-83-480M29-001148

    514-83-480M29-001148

    CONN SOCKET BGA 480POS GOLD

    Preci-Dip

    4,441
    514-83-480M29-001148

    规格书

    514 Bulk Active BGA 480 (29 x 29) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    518-77-400M20-000105

    518-77-400M20-000105

    CONN SOCKET PGA 400POS GOLD

    Preci-Dip

    3,267
    518-77-400M20-000105

    规格书

    518 Bulk Active PGA 400 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    110-33-640-41-001000

    110-33-640-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    2,011
    110-33-640-41-001000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
    210-33-640-41-001000

    210-33-640-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    3,256
    210-33-640-41-001000

    规格书

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
    65-PRS10008-12

    65-PRS10008-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    1,247
    65-PRS10008-12

    规格书

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    550-10-652M35-001166

    550-10-652M35-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    3,469
    550-10-652M35-001166

    规格书

    550 Bulk Active BGA 652 (35 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    66-PLS11054-12

    66-PLS11054-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,604
    66-PLS11054-12

    规格书

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    550-10-456M26-001152

    550-10-456M26-001152

    BGA SOLDER TAIL

    Preci-Dip

    3,612
    550-10-456M26-001152

    规格书

    550 Bulk Active BGA 456 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    546-83-528-21-121147

    546-83-528-21-121147

    CONN SOCKET PGA 528POS GOLD

    Preci-Dip

    3,250
    546-83-528-21-121147

    规格书

    546 Bulk Active PGA 528 (21 x 21) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    558-10-432M31-001101

    558-10-432M31-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    4,414
    558-10-432M31-001101

    规格书

    558 Bulk Active PGA 432 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    68-PLS11033-12

    68-PLS11033-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,319
    68-PLS11033-12

    规格书

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    546-83-529-21-121147

    546-83-529-21-121147

    CONN SOCKET PGA 529POS GOLD

    Preci-Dip

    2,354
    546-83-529-21-121147

    规格书

    546 Bulk Active PGA 529 (21 x 21) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    42-3554-16

    42-3554-16

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    4,812
    42-3554-16

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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