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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    108-PRS12024-12

    108-PRS12024-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,790
    108-PRS12024-12

    规格书

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    108-PRS13129-12

    108-PRS13129-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,284
    108-PRS13129-12

    规格书

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    2256-9020-00-2401

    2256-9020-00-2401

    3M TEXTOOL 2256-9020-00-2401 PP1

    3M

    4,052
    2256-9020-00-2401

    规格书

    Textool™ Bulk Obsolete - - - - - - - - - - - - - - -
    48-3551-16

    48-3551-16

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    2,409
    48-3551-16

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-3552-16

    48-3552-16

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    2,891
    48-3552-16

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-3553-16

    48-3553-16

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    2,226
    48-3553-16

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6551-16

    48-6551-16

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    1,457
    48-6551-16

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6552-16

    48-6552-16

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    3,609
    48-6552-16

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6553-16

    48-6553-16

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    4,673
    48-6553-16

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    518-77-500M30-001106

    518-77-500M30-001106

    CONN SOCKET PGA 500POS GOLD

    Preci-Dip

    3,540
    518-77-500M30-001106

    规格书

    518 Bulk Active PGA 500 (30 x 30) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    550-10-576M30-001152

    550-10-576M30-001152

    BGA SOLDER TAIL

    Preci-Dip

    2,682
    550-10-576M30-001152

    规格书

    550 Bulk Active BGA 576 (30 x 30) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    518-77-504M29-001106

    518-77-504M29-001106

    CONN SOCKET PGA 504POS GOLD

    Preci-Dip

    1,790
    518-77-504M29-001106

    规格书

    518 Bulk Active PGA 504 (29 x 29) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    235-3019-01-0602

    235-3019-01-0602

    CONN ZIG-ZAG ZIF 35POS GOLD

    3M

    3,906
    235-3019-01-0602

    规格书

    Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    558-10-520M31-001104

    558-10-520M31-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    1,159
    558-10-520M31-001104

    规格书

    558 Bulk Active BGA 520 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    44-6570-16

    44-6570-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    1,077
    44-6570-16

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    518-77-520M31-001105

    518-77-520M31-001105

    CONN SOCKET PGA 520POS GOLD

    Preci-Dip

    4,909
    518-77-520M31-001105

    规格书

    518 Bulk Active PGA 520 (31 x 31) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    120-PLS13015-12

    120-PLS13015-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,315
    120-PLS13015-12

    规格书

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    120-PRS13015-12

    120-PRS13015-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    1,850
    120-PRS13015-12

    规格书

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    24-3551-18

    24-3551-18

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    3,305
    24-3551-18

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    47-PLS16021-12

    47-PLS16021-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    1,975
    47-PLS16021-12

    规格书

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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