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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    518-77-520M31-001106

    518-77-520M31-001106

    CONN SOCKET PGA 520POS GOLD

    Preci-Dip

    4,968
    518-77-520M31-001106

    规格书

    518 Bulk Active PGA 520 (31 x 31) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    105-PLS17055-12

    105-PLS17055-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,874
    105-PLS17055-12

    规格书

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    105-PRS17054-12

    105-PRS17054-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,467
    105-PRS17054-12

    规格书

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    550-10-600M35-001152

    550-10-600M35-001152

    BGA SOLDER TAIL

    Preci-Dip

    2,713
    550-10-600M35-001152

    规格书

    550 Bulk Active BGA 600 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    191-PGM18015-10T

    191-PGM18015-10T

    CONN SOCKET PGA TIN

    Aries Electronics

    1,165
    191-PGM18015-10T

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    64-PLS16016-12

    64-PLS16016-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,689
    64-PLS16016-12

    规格书

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    101-PRS14030-12

    101-PRS14030-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,947
    101-PRS14030-12

    规格书

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    558-10-576M30-001101

    558-10-576M30-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    3,671
    558-10-576M30-001101

    规格书

    558 Bulk Active PGA 576 (30 x 30) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    514-83-652M35-001148

    514-83-652M35-001148

    CONN SOCKET BGA 652POS GOLD

    Preci-Dip

    4,512
    514-83-652M35-001148

    规格书

    514 Bulk Active BGA 652 (35 x 35) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-3551-18

    28-3551-18

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    2,547
    28-3551-18

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    234-3034-02-0602

    234-3034-02-0602

    CONN ZIG-ZAG ZIF 34POS GOLD

    3M

    2,202
    234-3034-02-0602

    规格书

    Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 34 (2 x 17) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    24-6574-18

    24-6574-18

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    2,370
    24-6574-18

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    558-10-560M33-001104

    558-10-560M33-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    4,243
    558-10-560M33-001104

    规格书

    558 Bulk Active BGA 560 (33 x 33) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    518-77-560M33-001105

    518-77-560M33-001105

    CONN SOCKET PGA 560POS GOLD

    Preci-Dip

    1,108
    518-77-560M33-001105

    规格书

    518 Bulk Active PGA 560 (33 x 33) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    558-10-600M35-001101

    558-10-600M35-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    3,809
    558-10-600M35-001101

    规格书

    558 Bulk Active PGA 600 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    168-PLS17011-12

    168-PLS17011-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,721
    168-PLS17011-12

    规格书

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    172-PLS16002-12

    172-PLS16002-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    1,177
    172-PLS16002-12

    规格书

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    24-6570-18

    24-6570-18

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    4,726
    24-6570-18

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    7010402515

    7010402515

    TEXTOOL1017-2-0252-0B-00L20 PP15

    3M

    3,099
    7010402515

    规格书

    - Bulk Active - - - - - - - - - - - - - - -
    518-77-560M33-001106

    518-77-560M33-001106

    CONN SOCKET PGA 560POS GOLD

    Preci-Dip

    4,318
    518-77-560M33-001106

    规格书

    518 Bulk Active PGA 560 (33 x 33) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
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