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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    AR 42-HZL/01-TT

    AR 42-HZL/01-TT

    SOCKET

    Assmann WSW Components

    4,134
    AR 42-HZL/01-TT

    规格书

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    116-87-316-41-008101

    116-87-316-41-008101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    1,711
    116-87-316-41-008101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-6518-10T

    28-6518-10T

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,151
    28-6518-10T

    规格书

    518 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    5-1437529-9

    5-1437529-9

    CONN IC DIP SOCKET 4POS GOLD

    TE Connectivity AMP Connectors

    1,621
    5-1437529-9

    规格书

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Thermoplastic, Polyester -55°C ~ 125°C
    SIP050-1X25-157B

    SIP050-1X25-157B

    1X25-157B-SIP SOCKET 25 CTS

    Amphenol ICC (FCI)

    1,656
    SIP050-1X25-157B

    规格书

    SIP050-1x Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    122-87-318-41-001101

    122-87-318-41-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,414
    122-87-318-41-001101

    规格书

    122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-87-318-41-001101

    123-87-318-41-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,106
    123-87-318-41-001101

    规格书

    123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0103-G-12

    HLS-0103-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,287
    HLS-0103-G-12

    规格书

    HLS Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    612-87-624-41-001101

    612-87-624-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,116
    612-87-624-41-001101

    规格书

    612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-314-41-001101

    116-87-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    4,722
    116-87-314-41-001101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    08-0518-11H

    08-0518-11H

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    2,261
    08-0518-11H

    规格书

    518 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-1518-11H

    08-1518-11H

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,139
    08-1518-11H

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-1518-11

    14-1518-11

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,912
    14-1518-11

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    17-0518-10H

    17-0518-10H

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    3,145
    17-0518-10H

    规格书

    518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-83-318-41-105101

    110-83-318-41-105101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    3,989
    110-83-318-41-105101

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 22-HZL/07-TT

    AR 22-HZL/07-TT

    SOCKET

    Assmann WSW Components

    1,512
    AR 22-HZL/07-TT

    规格书

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    ICO-308-STT-L

    ICO-308-STT-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,594
    ICO-308-STT-L

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    116-83-310-41-011101

    116-83-310-41-011101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,432
    116-83-310-41-011101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-322-41-003101

    116-87-322-41-003101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,380
    116-87-322-41-003101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    122-83-314-41-001101

    122-83-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    2,603
    122-83-314-41-001101

    规格书

    122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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