您好,欢迎来到双灏业商城!
    双灏业商城0755-83179664

    IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    ICF-308-TM-I

    ICF-308-TM-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,960
    ICF-308-TM-I

    规格书

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    09-0513-11

    09-0513-11

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    3,625
    09-0513-11

    规格书

    0513 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-0518-11

    14-0518-11

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    3,249
    14-0518-11

    规格书

    518 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    SIP050-1X21-160B

    SIP050-1X21-160B

    1X21-160B-SIP SOCKET 21 CTS

    Amphenol ICC (FCI)

    4,367
    SIP050-1X21-160B

    规格书

    SIP050-1x Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    HLS-0203-T-2

    HLS-0203-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,092
    HLS-0203-T-2

    规格书

    HLS Tube Active SIP 6 (2 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-87-420-41-018101

    116-87-420-41-018101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    1,357
    116-87-420-41-018101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    121-83-314-41-001101

    121-83-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    4,509
    121-83-314-41-001101

    规格书

    121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-610-41-011101

    116-83-610-41-011101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    1,475
    116-83-610-41-011101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    19-0518-10T

    19-0518-10T

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    4,850
    19-0518-10T

    规格书

    518 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    21-0518-10

    21-0518-10

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    2,825
    21-0518-10

    规格书

    518 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    SIP050-1X22-160B

    SIP050-1X22-160B

    1X22-160B-SIP SOCKET 22 CTS

    Amphenol ICC (FCI)

    2,574
    SIP050-1X22-160B

    规格书

    SIP050-1x Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    9-1437535-1

    9-1437535-1

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    3,397
    9-1437535-1

    规格书

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy - -55°C ~ 125°C
    HLS-0202-G-10

    HLS-0202-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,265
    HLS-0202-G-10

    规格书

    HLS Tube Active SIP 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    110-83-324-41-005101

    110-83-324-41-005101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,133
    110-83-324-41-005101

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-324-41-605101

    110-83-324-41-605101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,870
    110-83-324-41-605101

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-424-41-005101

    110-83-424-41-005101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,952
    110-83-424-41-005101

    规格书

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X26-157B

    SIP050-1X26-157B

    1X26-157B-SIP SOCKET 26 CTS

    Amphenol ICC (FCI)

    1,152
    SIP050-1X26-157B

    规格书

    SIP050-1x Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    115-83-422-41-003101

    115-83-422-41-003101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    1,904
    115-83-422-41-003101

    规格书

    115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-632-41-117101

    114-87-632-41-117101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    1,064
    114-87-632-41-117101

    规格书

    114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-632-41-134161

    114-87-632-41-134161

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,610
    114-87-632-41-134161

    规格书

    114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    联系我们 获取更多产品资讯!
    双灏业商城

    首页

    双灏业商城

    产品中心

    双灏业商城

    电话

    双灏业商城

    会员中心

    品种齐全,轻松购物
    品种齐全,轻松购物
    多仓直发,极速配送
    多仓直发,极速配送
    正品行货,精致服务
    正品行货,精致服务
    天天低价,畅选无忧
    天天低价,畅选无忧
    版权所有©2025 双灏业商城