您好,欢迎来到双灏业商城!
    双灏业商城0755-83179664

    IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    540-99-084-17-400000

    540-99-084-17-400000

    CONN SOCKET PLCC 84POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    2,222
    540-99-084-17-400000

    规格书

    540 Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
    HLS-0303-TT-11

    HLS-0303-TT-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,387
    HLS-0303-TT-11

    规格书

    HLS Tube Active SIP 9 (3 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    110-83-328-01-762101

    110-83-328-01-762101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,273
    110-83-328-01-762101

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14), 16 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-87-620-41-105101

    117-87-620-41-105101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    1,204
    117-87-620-41-105101

    规格书

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-322-31-012101

    614-87-322-31-012101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,201
    614-87-322-31-012101

    规格书

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-318-41-001101

    614-83-318-41-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,396
    614-83-318-41-001101

    规格书

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    10-0513-10H

    10-0513-10H

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    4,374
    10-0513-10H

    规格书

    0513 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    04-0503-20

    04-0503-20

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    1,684
    04-0503-20

    规格书

    0503 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    04-0503-30

    04-0503-30

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    2,299
    04-0503-30

    规格书

    0503 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    20-0518-10

    20-0518-10

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    1,443
    20-0518-10

    规格书

    518 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-87-044-08-031101

    510-87-044-08-031101

    CONN SOCKET PGA 44POS GOLD

    Preci-Dip

    3,321
    510-87-044-08-031101

    规格书

    510 Bulk Active PGA 44 (8 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-316-41-035101

    146-87-316-41-035101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,273
    146-87-316-41-035101

    规格书

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-316-41-036101

    146-87-316-41-036101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    1,405
    146-87-316-41-036101

    规格书

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    917-87-210-41-005101

    917-87-210-41-005101

    CONN TRANSIST TO-5 10POS GOLD

    Preci-Dip

    4,205
    917-87-210-41-005101

    规格书

    917 Bulk Active Transistor, TO-5 10 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    917-83-208-41-005101

    917-83-208-41-005101

    CONN TRANSIST TO-5 8POS GOLD

    Preci-Dip

    3,810
    917-83-208-41-005101

    规格书

    917 Bulk Active Transistor, TO-5 8 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X24-157B

    SIP050-1X24-157B

    1X24-157B-SIP SOCKET 24 CTS

    Amphenol ICC (FCI)

    1,438
    SIP050-1X24-157B

    规格书

    SIP050-1x Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    114-83-320-41-134161

    114-83-320-41-134161

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    2,760
    114-83-320-41-134161

    规格书

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-314-41-012101

    116-83-314-41-012101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    4,487
    116-83-314-41-012101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR20-HZL/01-TT-R

    AR20-HZL/01-TT-R

    CONN IC DIP SOCKET 20POS GOLD

    Assmann WSW Components

    1,156
    AR20-HZL/01-TT-R

    规格书

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    4-1437539-6

    4-1437539-6

    CONN IC DIP SOCKET 18POS TINLEAD

    TE Connectivity AMP Connectors

    3,321
    4-1437539-6

    规格书

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin-Lead - Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    联系我们 获取更多产品资讯!
    双灏业商城

    首页

    双灏业商城

    产品中心

    双灏业商城

    电话

    双灏业商城

    会员中心

    品种齐全,轻松购物
    品种齐全,轻松购物
    多仓直发,极速配送
    多仓直发,极速配送
    正品行货,精致服务
    正品行货,精致服务
    天天低价,畅选无忧
    天天低价,畅选无忧
    版权所有©2025 双灏业商城