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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    116-87-422-41-006101

    116-87-422-41-006101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    1,994
    116-87-422-41-006101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    540-99-084-24-000000

    540-99-084-24-000000

    CONN SOCKET PLCC 84POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    2,194
    540-99-084-24-000000

    规格书

    540 Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
    HLS-0104-T-31

    HLS-0104-T-31

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,988
    HLS-0104-T-31

    规格书

    HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    110-87-632-41-001151

    110-87-632-41-001151

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,358
    110-87-632-41-001151

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    C8140-04

    C8140-04

    CONN IC DIP SOCKET 40POS TIN

    Aries Electronics

    4,829
    C8140-04

    规格书

    Edge-Grip™, C81 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-0513-10T

    17-0513-10T

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    2,069
    17-0513-10T

    规格书

    0513 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-1518-10T

    20-1518-10T

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,859
    20-1518-10T

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-1518-10

    22-1518-10

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,090
    22-1518-10

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    06-0513-11H

    06-0513-11H

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    1,871
    06-0513-11H

    规格书

    0513 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    04-0508-30

    04-0508-30

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    3,087
    04-0508-30

    规格书

    508 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    04-1508-30

    04-1508-30

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    4,821
    04-1508-30

    规格书

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    540-44-028-24-000000

    540-44-028-24-000000

    CONN SOCKET PLCC 28POS TIN

    Mill-Max Manufacturing Corp.

    1,847
    540-44-028-24-000000

    规格书

    540 Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
    SIP1X32-041B

    SIP1X32-041B

    SIP1X32-041B-SIP SOCKET 32 CTS

    Amphenol ICC (FCI)

    1,773
    SIP1X32-041B

    规格书

    SIP1x Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    110-87-328-41-105101

    110-87-328-41-105101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,322
    110-87-328-41-105101

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    4-382568-8

    4-382568-8

    CONN IC DIP SOCKET 48POS TIN

    TE Connectivity AMP Connectors

    1,293
    4-382568-8

    规格书

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
    614-87-428-41-001101

    614-87-428-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,501
    614-87-428-41-001101

    规格书

    614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1-1825108-1

    1-1825108-1

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    3,623
    1-1825108-1

    规格书

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    116-87-316-41-002101

    116-87-316-41-002101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    1,615
    116-87-316-41-002101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-636-41-001101

    110-87-636-41-001101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    4,205
    110-87-636-41-001101

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-424-31-012101

    614-87-424-31-012101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,179
    614-87-424-31-012101

    规格书

    614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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