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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    614-87-324-31-012101

    614-87-324-31-012101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,283
    614-87-324-31-012101

    规格书

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-316-STT

    ICO-316-STT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,878
    ICO-316-STT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    SIP050-1X23-160B

    SIP050-1X23-160B

    1X23-160B-SIP SOCKET 23 CTS

    Amphenol ICC (FCI)

    4,540
    SIP050-1X23-160B

    规格书

    SIP050-1x Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    1-822473-6

    1-822473-6

    CONN SOCKET PLCC 68POS TIN

    TE Connectivity AMP Connectors

    3,070
    1-822473-6

    规格书

    - Box Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic -
    08-0513-11H

    08-0513-11H

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    4,727
    08-0513-11H

    规格书

    0513 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    11-0513-10H

    11-0513-10H

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    1,426
    11-0513-10H

    规格书

    0513 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0204-TT-11

    HLS-0204-TT-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,950
    HLS-0204-TT-11

    规格书

    HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    09-0518-00

    09-0518-00

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    2,471
    09-0518-00

    规格书

    518 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0202-G-11

    HLS-0202-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,505
    HLS-0202-G-11

    规格书

    HLS Tube Active SIP 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    2-1571586-3

    2-1571586-3

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    1,112
    2-1571586-3

    规格书

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    115-87-636-41-001101

    115-87-636-41-001101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    2,046
    115-87-636-41-001101

    规格书

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-610-41-004101

    116-87-610-41-004101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    1,893
    116-87-610-41-004101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-306-41-013101

    116-83-306-41-013101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    2,329
    116-83-306-41-013101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-624-41-001101

    115-83-624-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,965
    115-83-624-41-001101

    规格书

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 22-HZL/01-TT

    AR 22-HZL/01-TT

    SOCKET

    Assmann WSW Components

    4,840
    AR 22-HZL/01-TT

    规格书

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    08-2511-10

    08-2511-10

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    4,306
    08-2511-10

    规格书

    511 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-0517-90C

    06-0517-90C

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    2,012
    06-0517-90C

    规格书

    0517 Bulk Active SIP 6 (1 x 6) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    114-83-322-41-117101

    114-83-322-41-117101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,140
    114-83-322-41-117101

    规格书

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-624-41-018101

    116-87-624-41-018101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,664
    116-87-624-41-018101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-318-41-018101

    116-83-318-41-018101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,900
    116-83-318-41-018101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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