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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    400-040-000

    400-040-000

    CONN IC DIP SOCKET 40POS GOLD

    3M

    1,343
    400-040-000

    规格书

    400 - Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
    345725-5

    345725-5

    CONN IC DIP SOCKET 22POS TINLEAD

    TE Connectivity AMP Connectors

    2,011
    345725-5

    规格书

    - Tube Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin-Lead - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - - - -
    SIP050-1X30-157B

    SIP050-1X30-157B

    1X30-157B-SIP SOCKET 30 CTS

    Amphenol ICC (FCI)

    1,026
    SIP050-1X30-157B

    规格书

    SIP050-1x Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    09-0513-11H

    09-0513-11H

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    2,099
    09-0513-11H

    规格书

    0513 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    AR 32-HZL/07-TT

    AR 32-HZL/07-TT

    CONN IC DIP SOCKET 32POS GOLD

    Assmann WSW Components

    2,416
    AR 32-HZL/07-TT

    规格书

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    824-AG31D-ESL-LF

    824-AG31D-ESL-LF

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    4,784
    824-AG31D-ESL-LF

    规格书

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    116-83-312-41-011101

    116-83-312-41-011101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    3,672
    116-83-312-41-011101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-422-41-012101

    116-87-422-41-012101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    3,008
    116-87-422-41-012101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-628-41-006101

    116-87-628-41-006101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,027
    116-87-628-41-006101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1-1437537-9

    1-1437537-9

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    1,110
    1-1437537-9

    规格书

    800 - Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - - -
    1-1437542-1

    1-1437542-1

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    3,468
    1-1437542-1

    规格书

    700 - Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy -55°C ~ 125°C
    10-0518-00

    10-0518-00

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    1,013
    10-0518-00

    规格书

    518 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    10-1518-00

    10-1518-00

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    1,662
    10-1518-00

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    299-83-308-11-001101

    299-83-308-11-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    4,269
    299-83-308-11-001101

    规格书

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-322-41-001101

    614-83-322-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    3,360
    614-83-322-41-001101

    规格书

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-422-41-001101

    614-83-422-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,995
    614-83-422-41-001101

    规格书

    614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-316-STL-O-TR

    ICF-316-STL-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,896
    ICF-316-STL-O-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-316-TL-I-TR

    ICF-316-TL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,493
    ICF-316-TL-I-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-316-TL-O-TR

    ICF-316-TL-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,778
    ICF-316-TL-O-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-316-STL-I-TR

    ICF-316-STL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,411
    ICF-316-STL-I-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
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