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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    05-0503-20

    05-0503-20

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    4,724
    05-0503-20

    规格书

    0503 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    05-0503-30

    05-0503-30

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    1,386
    05-0503-30

    规格书

    0503 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    12-0518-00

    12-0518-00

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    3,757
    12-0518-00

    规格书

    518 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    17-0518-11

    17-0518-11

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    1,631
    17-0518-11

    规格书

    518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    21-0518-10H

    21-0518-10H

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    3,881
    21-0518-10H

    规格书

    518 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    06-0508-20

    06-0508-20

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    1,514
    06-0508-20

    规格书

    508 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    06-0508-30

    06-0508-30

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    2,928
    06-0508-30

    规格书

    508 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    06-1508-20

    06-1508-20

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    1,100
    06-1508-20

    规格书

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    06-1508-30

    06-1508-30

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    3,715
    06-1508-30

    规格书

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    116-83-420-41-006101

    116-83-420-41-006101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    2,277
    116-83-420-41-006101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-328-41-005101

    110-83-328-41-005101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,240
    110-83-328-41-005101

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-640-41-001101

    115-87-640-41-001101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    4,367
    115-87-640-41-001101

    规格书

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-320-41-002101

    116-87-320-41-002101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,118
    116-87-320-41-002101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-308-F-O

    ICF-308-F-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,489
    ICF-308-F-O

    规格书

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-308-F-I

    ICF-308-F-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,091
    ICF-308-F-I

    规格书

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    114-83-424-41-117101

    114-83-424-41-117101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,989
    114-83-424-41-117101

    规格书

    114 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0106-T-10

    HLS-0106-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,672
    HLS-0106-T-10

    规格书

    HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-87-318-41-002101

    116-87-318-41-002101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    1,394
    116-87-318-41-002101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-316-41-007101

    116-83-316-41-007101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    2,953
    116-83-316-41-007101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-428-41-005101

    110-83-428-41-005101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    1,582
    110-83-428-41-005101

    规格书

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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