您好,欢迎来到双灏业商城!
    双灏业商城0755-83179664

    IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    AR 52-HZL/01-TT

    AR 52-HZL/01-TT

    SOCKET

    Assmann WSW Components

    4,197
    AR 52-HZL/01-TT

    规格书

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    BU220Z-178-HT

    BU220Z-178-HT

    CONN IC DIP SOCKET 22POS GOLD

    On Shore Technology Inc.

    2,678
    BU220Z-178-HT

    规格书

    BU-178HT Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    AR 64-HZL-TT

    AR 64-HZL-TT

    CONN IC DIP SOCKET 64POS TIN

    Assmann WSW Components

    3,800
    AR 64-HZL-TT

    规格书

    - Tray Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    ICF-314-TM-O

    ICF-314-TM-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,966
    ICF-314-TM-O

    规格书

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-314-T-I

    ICF-314-T-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,430
    ICF-314-T-I

    规格书

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    4620

    4620

    CONN TRANSIST TO-3 3POS TIN

    Keystone Electronics

    4,253
    4620

    规格书

    - Bulk Obsolete Transistor, TO-3 3 (Rectangular) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
    540-44-044-24-000000

    540-44-044-24-000000

    CONN SOCKET PLCC 44POS TIN

    Mill-Max Manufacturing Corp.

    3,976
    540-44-044-24-000000

    规格书

    540 Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
    06-6513-10H

    06-6513-10H

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    2,121
    06-6513-10H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    11-0513-11

    11-0513-11

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    1,677
    11-0513-11

    规格书

    0513 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    23-0518-10T

    23-0518-10T

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    1,024
    23-0518-10T

    规格书

    518 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    212-1-16-003

    212-1-16-003

    CONN IC DIP SOCKET 16POS GOLD

    CNC Tech

    3,090
    212-1-16-003

    规格书

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
    HLS-0114-TT-2

    HLS-0114-TT-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,378
    HLS-0114-TT-2

    规格书

    HLS Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    614-87-432-41-001101

    614-87-432-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,620
    614-87-432-41-001101

    规格书

    614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    299-87-310-11-001101

    299-87-310-11-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    1,966
    299-87-310-11-001101

    规格书

    299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-328-41-001101

    115-83-328-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,971
    115-83-328-41-001101

    规格书

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    122-87-320-41-001101

    122-87-320-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    1,959
    122-87-320-41-001101

    规格书

    122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-87-422-41-001101

    123-87-422-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    1,880
    123-87-422-41-001101

    规格书

    123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APO-314-T-J

    APO-314-T-J

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,524
    APO-314-T-J

    规格书

    APO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    D0818-01

    D0818-01

    CONN IC DIP SOCKET 18POS GOLD

    Harwin Inc.

    1,980
    D0818-01

    规格书

    D0 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SMPX-68LCC-P

    SMPX-68LCC-P

    SMT PLCC SOCKET 68P POLARISED RO

    Kycon, Inc.

    1,331
    SMPX-68LCC-P

    规格书

    SMPX Tube Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
    联系我们 获取更多产品资讯!
    双灏业商城

    首页

    双灏业商城

    产品中心

    双灏业商城

    电话

    双灏业商城

    会员中心

    品种齐全,轻松购物
    品种齐全,轻松购物
    多仓直发,极速配送
    多仓直发,极速配送
    正品行货,精致服务
    正品行货,精致服务
    天天低价,畅选无忧
    天天低价,畅选无忧
    版权所有©2025 双灏业商城