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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    22-0518-10H

    22-0518-10H

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    1,209
    22-0518-10H

    规格书

    518 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-1518-10H

    22-1518-10H

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    1,829
    22-1518-10H

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    07-0517-90C

    07-0517-90C

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    4,518
    07-0517-90C

    规格书

    0517 Bulk Active SIP 7 (1 x 7) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    210-1-48-006

    210-1-48-006

    CONN IC DIP SOCKET 48POS GOLD

    CNC Tech

    4,104
    210-1-48-006

    规格书

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
    110-87-642-41-001101

    110-87-642-41-001101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    1,967
    110-87-642-41-001101

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-420-41-018101

    116-83-420-41-018101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,522
    116-83-420-41-018101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-432-41-001101

    110-83-432-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,711
    110-83-432-41-001101

    规格书

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-422-41-105101

    110-83-422-41-105101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    3,989
    110-83-422-41-105101

    规格书

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A-CCS84-G

    A-CCS84-G

    CONN SOCKET PLCC 84POS GOLD

    Assmann WSW Components

    3,815
    A-CCS84-G

    规格书

    - Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    HLS-0203-G-2

    HLS-0203-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,105
    HLS-0203-G-2

    规格书

    HLS Tube Active SIP 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    HLS-0109-TT-12

    HLS-0109-TT-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,081
    HLS-0109-TT-12

    规格书

    HLS Tube Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    SIP050-1X27-160B

    SIP050-1X27-160B

    1X27-160B-SIP SOCKET 27 CTS

    Amphenol ICC (FCI)

    3,089
    SIP050-1X27-160B

    规格书

    SIP050-1x Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    16-3518-00

    16-3518-00

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,206
    16-3518-00

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-87-648-41-005101

    110-87-648-41-005101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    2,761
    110-87-648-41-005101

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-628-41-018101

    116-87-628-41-018101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,188
    116-87-628-41-018101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP1X30-041B

    SIP1X30-041B

    SIP1X30-041B-SIP SOCKET 30 CTS

    Amphenol ICC (FCI)

    3,658
    SIP1X30-041B

    规格书

    SIP1x Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    116-83-318-41-012101

    116-83-318-41-012101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,725
    116-83-318-41-012101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-328-41-105161

    110-87-328-41-105161

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,654
    110-87-328-41-105161

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-328-41-006101

    116-87-328-41-006101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,092
    116-87-328-41-006101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-628-41-001101

    115-83-628-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,502
    115-83-628-41-001101

    规格书

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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