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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    3-1437535-4

    3-1437535-4

    CONN SOCKET SIP 20POS GOLD

    TE Connectivity AMP Connectors

    3,712
    3-1437535-4

    规格书

    500 Bulk Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper - -
    115-83-428-41-001101

    115-83-428-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    1,571
    115-83-428-41-001101

    规格书

    115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X31-157B

    SIP050-1X31-157B

    1X31-157B-SIP SOCKET 31 CTS

    Amphenol ICC (FCI)

    3,718
    SIP050-1X31-157B

    规格书

    SIP050-1x Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    AR 24-HZL/07/7-TT

    AR 24-HZL/07/7-TT

    CONN IC DIP SOCKET 24POS GOLD

    Assmann WSW Components

    4,877
    AR 24-HZL/07/7-TT

    规格书

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    117-83-428-41-005101

    117-83-428-41-005101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,234
    117-83-428-41-005101

    规格书

    117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-320-41-035101

    146-87-320-41-035101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    1,537
    146-87-320-41-035101

    规格书

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-320-41-036101

    146-87-320-41-036101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    1,983
    146-87-320-41-036101

    规格书

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-628-41-001101

    614-87-628-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,304
    614-87-628-41-001101

    规格书

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-0513-10

    18-0513-10

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    2,573
    18-0513-10

    规格书

    0513 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    10-0518-11H

    10-0518-11H

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    2,954
    10-0518-11H

    规格书

    518 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    10-1518-11H

    10-1518-11H

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,049
    10-1518-11H

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0104-T-32

    HLS-0104-T-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,386
    HLS-0104-T-32

    规格书

    HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    117-83-628-41-005101

    117-83-628-41-005101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,782
    117-83-628-41-005101

    规格书

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SMPX-52LCC-N-TR

    SMPX-52LCC-N-TR

    SMT PLCC 52P NON POLARISED, T&R

    Kycon, Inc.

    3,754
    SMPX-52LCC-N-TR

    规格书

    SMPX Tape & Reel (TR) Active PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
    110-83-314-41-801101

    110-83-314-41-801101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    1,423
    110-83-314-41-801101

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    06-3513-11H

    06-3513-11H

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    2,855
    06-3513-11H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICF-314-TL-O-TR

    ICF-314-TL-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,004
    ICF-314-TL-O-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    08-3511-10

    08-3511-10

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    3,456
    08-3511-10

    规格书

    511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-1518-10T

    18-1518-10T

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    1,271
    18-1518-10T

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    11-0518-00

    11-0518-00

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    2,987
    11-0518-00

    规格书

    518 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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