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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    38-0518-10

    38-0518-10

    CONN SOCKET SIP 38POS GOLD

    Aries Electronics

    2,872
    38-0518-10

    规格书

    518 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    40-0518-10T

    40-0518-10T

    CONN SOCKET SIP 40POS GOLD

    Aries Electronics

    3,146
    40-0518-10T

    规格书

    518 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    122-83-624-41-001101

    122-83-624-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,112
    122-83-624-41-001101

    规格书

    122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-83-624-41-001101

    123-83-624-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,125
    123-83-624-41-001101

    规格书

    123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-314-SST

    ICO-314-SST

    CONN IC DIP SOCKET 14POS GOLD

    Samtec Inc.

    1,290
    ICO-314-SST

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0207-TT-10

    HLS-0207-TT-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,073
    HLS-0207-TT-10

    规格书

    HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    ICO-422-STT-L

    ICO-422-STT-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,497
    ICO-422-STT-L

    规格书

    ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    116-83-628-41-003101

    116-83-628-41-003101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,264
    116-83-628-41-003101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-0518-10

    28-0518-10

    CONN SOCKET SIP 28POS GOLD

    Aries Electronics

    4,832
    28-0518-10

    规格书

    518 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-1518-10

    28-1518-10

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,368
    28-1518-10

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0208-TT-11

    HLS-0208-TT-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,346
    HLS-0208-TT-11

    规格书

    HLS Tube Active SIP 16 (2 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    ICA-314-SST-L

    ICA-314-SST-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,624
    ICA-314-SST-L

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    116-83-324-41-012101

    116-83-324-41-012101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,084
    116-83-324-41-012101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-3518-10H

    20-3518-10H

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,548
    20-3518-10H

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1-1437537-1

    1-1437537-1

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    3,489
    1-1437537-1

    规格书

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Surface Mount Open Frame Solder 0.100" (2.54mm) - - Brass Thermoplastic -55°C ~ 125°C
    08-2501-30

    08-2501-30

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    4,803
    08-2501-30

    规格书

    501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    10-2513-11H

    10-2513-11H

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,549
    10-2513-11H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-0513-11

    17-0513-11

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    3,333
    17-0513-11

    规格书

    0513 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-3518-01

    08-3518-01

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,021
    08-3518-01

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICF-624-STL-I-TR

    ICF-624-STL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,106
    ICF-624-STL-I-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
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