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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    ICF-624-TL-I-TR

    ICF-624-TL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,468
    ICF-624-TL-I-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    116-87-420-41-011101

    116-87-420-41-011101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,023
    116-87-420-41-011101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-324-41-007101

    116-83-324-41-007101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,711
    116-83-324-41-007101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-628-41-008101

    116-87-628-41-008101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,486
    116-87-628-41-008101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-640-41-018101

    116-87-640-41-018101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    3,296
    116-87-640-41-018101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-316-TL-O

    ICF-316-TL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,025
    ICF-316-TL-O

    规格书

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    HLS-0303-G-2

    HLS-0303-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,236
    HLS-0303-G-2

    规格书

    HLS Tube Active SIP 9 (3 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    818-AG11D

    818-AG11D

    CONN IC DIP SOCKET 18POS GOLD

    TE Connectivity AMP Connectors

    3,108
    818-AG11D

    规格书

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    HLS-0207-S-2

    HLS-0207-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,831
    HLS-0207-S-2

    规格书

    HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    HLS-0107-T-32

    HLS-0107-T-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,831
    HLS-0107-T-32

    规格书

    HLS Tube Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-83-316-41-004101

    116-83-316-41-004101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,664
    116-83-316-41-004101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-320-41-001101

    116-83-320-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    2,826
    116-83-320-41-001101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    14-3513-11

    14-3513-11

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,137
    14-3513-11

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-6513-11

    12-6513-11

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    1,210
    12-6513-11

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-4513-10T

    22-4513-10T

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    2,638
    22-4513-10T

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-1518-00

    14-1518-00

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,560
    14-1518-00

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-3518-10H

    14-3518-10H

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    1,889
    14-3518-10H

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-9513-10T

    20-9513-10T

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,763
    20-9513-10T

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    26-3513-10T

    26-3513-10T

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    3,151
    26-3513-10T

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    05-0503-31

    05-0503-31

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    2,464
    05-0503-31

    规格书

    0503 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
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