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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    ICA-324-ZSTT

    ICA-324-ZSTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,869
    ICA-324-ZSTT

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICO-324-ZSTT

    ICO-324-ZSTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,955
    ICO-324-ZSTT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    116-83-420-41-001101

    116-83-420-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    2,168
    116-83-420-41-001101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    12-3513-10H

    12-3513-10H

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    2,975
    12-3513-10H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICO-308-ZMGT

    ICO-308-ZMGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,370
    ICO-308-ZMGT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    D0832-42

    D0832-42

    CONN IC DIP SOCKET 32POS GOLD

    Harwin Inc.

    2,927
    D0832-42

    规格书

    D0 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-432-41-105101

    110-83-432-41-105101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,524
    110-83-432-41-105101

    规格书

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-428-41-003101

    116-83-428-41-003101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,841
    116-83-428-41-003101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-328-41-035101

    146-87-328-41-035101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,631
    146-87-328-41-035101

    规格书

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-328-41-036101

    146-87-328-41-036101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    1,635
    146-87-328-41-036101

    规格书

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    C9116-00

    C9116-00

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,280
    C9116-00

    规格书

    Edge-Grip™, C91 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    HLS-0112-T-2

    HLS-0112-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,497
    HLS-0112-T-2

    规格书

    HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-83-424-41-007101

    116-83-424-41-007101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,646
    116-83-424-41-007101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    26-0518-10T

    26-0518-10T

    CONN SOCKET SIP 26POS GOLD

    Aries Electronics

    2,738
    26-0518-10T

    规格书

    518 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    26-1518-10T

    26-1518-10T

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    1,752
    26-1518-10T

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-87-628-41-105191

    110-87-628-41-105191

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,546
    110-87-628-41-105191

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-428-41-009101

    116-87-428-41-009101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,475
    116-87-428-41-009101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    D0824-01

    D0824-01

    CONN IC DIP SOCKET 24POS GOLD

    Harwin Inc.

    1,738
    D0824-01

    规格书

    D0 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0110-T-2

    HLS-0110-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,264
    HLS-0110-T-2

    规格书

    HLS Tube Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-87-320-41-004101

    116-87-320-41-004101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,106
    116-87-320-41-004101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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