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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    A-ICS-254-24-TT50

    A-ICS-254-24-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    2,063
    A-ICS-254-24-TT50

    规格书

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    38-0518-10T

    38-0518-10T

    CONN SOCKET SIP 38POS GOLD

    Aries Electronics

    1,196
    38-0518-10T

    规格书

    518 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    38-1518-10T

    38-1518-10T

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    2,794
    38-1518-10T

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-3518-11

    18-3518-11

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    1,381
    18-3518-11

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-424-41-008101

    116-83-424-41-008101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,525
    116-83-424-41-008101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0114-TT-10

    HLS-0114-TT-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,480
    HLS-0114-TT-10

    规格书

    HLS Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    116-87-432-41-002101

    116-87-432-41-002101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,827
    116-87-432-41-002101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-316-SST-L

    ICA-316-SST-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,694
    ICA-316-SST-L

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    1571994-8

    1571994-8

    CONN SOCKET SIP 10POS GOLD

    TE Connectivity AMP Connectors

    2,991
    1571994-8

    规格书

    510 Tube Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 20.0µin (0.51µm) Copper Thermoplastic, Polyester -
    124-83-320-41-002101

    124-83-320-41-002101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,875
    124-83-320-41-002101

    规格书

    124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    2-1571586-6

    2-1571586-6

    CONN IC DIP SOCKET 20POS GOLD

    TE Connectivity AMP Connectors

    2,402
    2-1571586-6

    规格书

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    116-87-424-41-011101

    116-87-424-41-011101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,386
    116-87-424-41-011101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-312-41-013101

    116-83-312-41-013101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    1,722
    116-83-312-41-013101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    10-2501-20

    10-2501-20

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    2,453
    10-2501-20

    规格书

    501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-2501-30

    10-2501-30

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    2,102
    10-2501-30

    规格书

    501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    21-0513-10H

    21-0513-10H

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    2,149
    21-0513-10H

    规格书

    0513 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    6-1437535-3

    6-1437535-3

    CONN SOCKET SIP 8POS GOLD

    TE Connectivity AMP Connectors

    3,442
    6-1437535-3

    规格书

    500 Tube Obsolete SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Thermoplastic -
    299-87-316-11-001101

    299-87-316-11-001101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    1,764
    299-87-316-11-001101

    规格书

    299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-314-CTT

    ICO-314-CTT

    CONN IC DIP SOCKET 14POS TIN

    Samtec Inc.

    1,492
    ICO-314-CTT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    117-87-640-41-105101

    117-87-640-41-105101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    1,167
    117-87-640-41-105101

    规格书

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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