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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    04-0501-30

    04-0501-30

    CONN SOCKET SIP 4POS TIN

    Aries Electronics

    3,255
    04-0501-30

    规格书

    501 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-0503-20

    08-0503-20

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    2,380
    08-0503-20

    规格书

    0503 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    08-0503-30

    08-0503-30

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    1,134
    08-0503-30

    规格书

    0503 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    16-0518-11H

    16-0518-11H

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    1,534
    16-0518-11H

    规格书

    518 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-1518-11H

    16-1518-11H

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,266
    16-1518-11H

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    37-0518-10T

    37-0518-10T

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    2,731
    37-0518-10T

    规格书

    518 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICF-328-TL-I-TR

    ICF-328-TL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,857
    ICF-328-TL-I-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    614-87-648-41-001101

    614-87-648-41-001101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    1,094
    614-87-648-41-001101

    规格书

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    D0724-01

    D0724-01

    CONN IC DIP SOCKET 24POS GOLD

    Harwin Inc.

    3,897
    D0724-01

    规格书

    D0 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-632-41-006101

    116-83-632-41-006101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,206
    116-83-632-41-006101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-324-41-011101

    116-87-324-41-011101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,337
    116-87-324-41-011101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-642-41-018101

    116-87-642-41-018101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    2,069
    116-87-642-41-018101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    3-1437537-5

    3-1437537-5

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    3,333
    3-1437537-5

    规格书

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    510-87-084-13-081101

    510-87-084-13-081101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    1,461
    510-87-084-13-081101

    规格书

    510 Bulk Active PGA 84 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-084-13-082101

    510-87-084-13-082101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    4,303
    510-87-084-13-082101

    规格书

    510 Bulk Active PGA 84 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-624-41-007101

    116-83-624-41-007101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,135
    116-83-624-41-007101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-83-428-41-105101

    117-83-428-41-105101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,764
    117-83-428-41-105101

    规格书

    117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-624-41-012101

    116-83-624-41-012101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,418
    116-83-624-41-012101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-424-41-002101

    116-83-424-41-002101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,800
    116-83-424-41-002101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    13-0513-11

    13-0513-11

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    1,743
    13-0513-11

    规格书

    0513 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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