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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    27-0518-10T

    27-0518-10T

    CONN SOCKET SIP 27POS GOLD

    Aries Electronics

    1,317
    27-0518-10T

    规格书

    518 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-628-41-009101

    116-87-628-41-009101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,357
    116-87-628-41-009101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-0513-11H

    18-0513-11H

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    4,835
    18-0513-11H

    规格书

    0513 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-4518-00

    24-4518-00

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,103
    24-4518-00

    规格书

    518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-C195-10

    16-C195-10

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,009
    16-C195-10

    规格书

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-316-WTT-2

    ICA-316-WTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,738
    ICA-316-WTT-2

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICF-322-T-O

    ICF-322-T-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,666
    ICF-322-T-O

    规格书

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-322-T-I

    ICF-322-T-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,113
    ICF-322-T-I

    规格书

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    510-87-097-11-041101

    510-87-097-11-041101

    CONN SOCKET PGA 97POS GOLD

    Preci-Dip

    4,568
    510-87-097-11-041101

    规格书

    510 Bulk Active PGA 97 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-314-41-013101

    116-87-314-41-013101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    4,504
    116-87-314-41-013101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-642-41-001101

    115-83-642-41-001101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    3,813
    115-83-642-41-001101

    规格书

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0303-T-10

    HLS-0303-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,555
    HLS-0303-T-10

    规格书

    HLS Tube Active SIP 9 (3 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    ICF-316-SM-O-TR

    ICF-316-SM-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,338
    ICF-316-SM-O-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-316-S-I-TR

    ICF-316-S-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,024
    ICF-316-S-I-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    34-0518-10H

    34-0518-10H

    CONN SOCKET SIP 34POS GOLD

    Aries Electronics

    1,108
    34-0518-10H

    规格书

    518 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0109-T-30

    HLS-0109-T-30

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,467
    HLS-0109-T-30

    规格书

    HLS Tube Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    ICF-324-T-I-TR

    ICF-324-T-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,011
    ICF-324-T-I-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    HLS-0107-G-10

    HLS-0107-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,653
    HLS-0107-G-10

    规格书

    HLS Tube Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    516-AG11D

    516-AG11D

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    2,235
    516-AG11D

    规格书

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    18-3513-11

    18-3513-11

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    1,217
    18-3513-11

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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