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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    124-83-420-41-002101

    124-83-420-41-002101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,176
    124-83-420-41-002101

    规格书

    124 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-642-41-003101

    116-87-642-41-003101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    1,854
    116-87-642-41-003101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    122-83-328-41-001101

    122-83-328-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,744
    122-83-328-41-001101

    规格书

    122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0108-T-11

    HLS-0108-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,157
    HLS-0108-T-11

    规格书

    HLS Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    ICO-320-STT-L

    ICO-320-STT-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,552
    ICO-320-STT-L

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    116-83-322-41-001101

    116-83-322-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    1,292
    116-83-322-41-001101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-422-41-001101

    116-83-422-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    3,802
    116-83-422-41-001101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    24-0513-10T

    24-0513-10T

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    2,136
    24-0513-10T

    规格书

    0513 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    26-0518-10H

    26-0518-10H

    CONN SOCKET SIP 26POS GOLD

    Aries Electronics

    2,275
    26-0518-10H

    规格书

    518 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    26-1518-10H

    26-1518-10H

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    3,966
    26-1518-10H

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    31-0518-10

    31-0518-10

    CONN SOCKET SIP 31POS GOLD

    Aries Electronics

    4,005
    31-0518-10

    规格书

    518 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-432-41-008101

    116-87-432-41-008101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,127
    116-87-432-41-008101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-624-41-001101

    116-87-624-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,621
    116-87-624-41-001101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0109-G-2

    HLS-0109-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,726
    HLS-0109-G-2

    规格书

    HLS Tube Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    HLS-0110-T-10

    HLS-0110-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,767
    HLS-0110-T-10

    规格书

    HLS Tube Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    BU280Z-178-HT

    BU280Z-178-HT

    CONN IC DIP SOCKET 28POS GOLD

    On Shore Technology Inc.

    2,655
    BU280Z-178-HT

    规格书

    BU-178HT Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    HLS-0205-T-30

    HLS-0205-T-30

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,977
    HLS-0205-T-30

    规格书

    HLS Tube Active SIP 10 (2 x 5) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    110-83-636-41-105101

    110-83-636-41-105101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    4,920
    110-83-636-41-105101

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-324-41-009101

    116-83-324-41-009101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,668
    116-83-324-41-009101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-6513-11

    18-6513-11

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,583
    18-6513-11

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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