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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    06-0503-31

    06-0503-31

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    2,791
    06-0503-31

    规格书

    0503 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    22-4518-10H

    22-4518-10H

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    2,561
    22-4518-10H

    规格书

    518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-0518-00

    22-0518-00

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    3,435
    22-0518-00

    规格书

    518 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-1518-00

    22-1518-00

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,492
    22-1518-00

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    115-87-964-41-001101

    115-87-964-41-001101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    3,153
    115-87-964-41-001101

    规格书

    115 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    31-0518-10T

    31-0518-10T

    CONN SOCKET SIP 31POS GOLD

    Aries Electronics

    1,292
    31-0518-10T

    规格书

    518 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-87-642-31-012101

    614-87-642-31-012101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    4,001
    614-87-642-31-012101

    规格书

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    17-0513-11H

    17-0513-11H

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    3,131
    17-0513-11H

    规格书

    0513 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    39-0518-10H

    39-0518-10H

    CONN SOCKET SIP 39POS GOLD

    Aries Electronics

    2,651
    39-0518-10H

    规格书

    518 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    117-83-432-41-105101

    117-83-432-41-105101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,863
    117-83-432-41-105101

    规格书

    117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    714-43-109-31-018000

    714-43-109-31-018000

    CONN SOCKET SIP 9POS GOLD

    Mill-Max Manufacturing Corp.

    1,364
    714-43-109-31-018000

    规格书

    714 Tube Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-314-T-A1

    APO-314-T-A1

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,229
    APO-314-T-A1

    规格书

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    HLS-0207-TT-12

    HLS-0207-TT-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,054
    HLS-0207-TT-12

    规格书

    HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    299-87-318-10-001101

    299-87-318-10-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,584
    299-87-318-10-001101

    规格书

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-648-41-001101

    115-83-648-41-001101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    2,760
    115-83-648-41-001101

    规格书

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-065-10-051101

    510-83-065-10-051101

    CONN SOCKET PGA 65POS GOLD

    Preci-Dip

    3,046
    510-83-065-10-051101

    规格书

    510 Bulk Active PGA 65 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0304-T-10

    HLS-0304-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,951
    HLS-0304-T-10

    规格书

    HLS Tube Active SIP 12 (3 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-87-316-41-013101

    116-87-316-41-013101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,618
    116-87-316-41-013101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    14-3518-102

    14-3518-102

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,239
    14-3518-102

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-3518-111

    14-3518-111

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,342
    14-3518-111

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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