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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    116-87-424-41-004101

    116-87-424-41-004101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,755
    116-87-424-41-004101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-628-41-007101

    116-83-628-41-007101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,333
    116-83-628-41-007101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    06-0508-21

    06-0508-21

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    1,402
    06-0508-21

    规格书

    508 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    06-0508-31

    06-0508-31

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    3,008
    06-0508-31

    规格书

    508 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    06-1508-21

    06-1508-21

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    1,837
    06-1508-21

    规格书

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    06-1508-31

    06-1508-31

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    3,159
    06-1508-31

    规格书

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    PLCC-044-T-A

    PLCC-044-T-A

    CONN SOCKET PLCC 44POS TIN

    Samtec Inc.

    1,285
    PLCC-044-T-A

    规格书

    PLCC Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    28-3518-11

    28-3518-11

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,948
    28-3518-11

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-83-650-41-005101

    110-83-650-41-005101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    2,885
    110-83-650-41-005101

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-624-MTT

    ICO-624-MTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,581
    ICO-624-MTT

    规格书

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICO-308-ZCGT

    ICO-308-ZCGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,252
    ICO-308-ZCGT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    21-0513-11

    21-0513-11

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    1,518
    21-0513-11

    规格书

    0513 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-0513-10H

    24-0513-10H

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    3,835
    24-0513-10H

    规格书

    0513 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    19-0518-11H

    19-0518-11H

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    1,620
    19-0518-11H

    规格书

    518 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    40-1518-10H

    40-1518-10H

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,598
    40-1518-10H

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-652-41-006101

    116-87-652-41-006101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    4,128
    116-87-652-41-006101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    2134146-2

    2134146-2

    CONN SOCKET PGA 989POS GOLD

    TE Connectivity AMP Connectors

    4,846
    2134146-2

    规格书

    - Tape & Reel (TR) Obsolete PGA 989 (35 x 36) 0.157" (4.00mm) Gold Flash Copper Alloy Surface Mount Open Frame Solder 0.157" (4.00mm) Tin-Lead Flash Copper Alloy Thermoplastic -
    10-6513-10H

    10-6513-10H

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,849
    10-6513-10H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-0518-00

    17-0518-00

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    2,706
    17-0518-00

    规格书

    518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    32-1518-10T

    32-1518-10T

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,985
    32-1518-10T

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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