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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    346-43-112-41-013000

    346-43-112-41-013000

    CONN SOCKET SIP 12POS GOLD

    Mill-Max Manufacturing Corp.

    2,532
    346-43-112-41-013000

    规格书

    346 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    212-1-28-006

    212-1-28-006

    CONN IC DIP SOCKET 28POS GOLD

    CNC Tech

    4,155
    212-1-28-006

    规格书

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
    HLS-0112-S-22

    HLS-0112-S-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,178
    HLS-0112-S-22

    规格书

    HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    34-3513-10T

    34-3513-10T

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    3,427
    34-3513-10T

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    614-83-636-31-012101

    614-83-636-31-012101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    3,603
    614-83-636-31-012101

    规格书

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    03-0511-10

    03-0511-10

    CONN SOCKET SIP 3POS TIN

    Aries Electronics

    2,733
    03-0511-10

    规格书

    511 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-6513-10

    30-6513-10

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    1,858
    30-6513-10

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-820-90C

    06-820-90C

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    4,092
    06-820-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-822-90C

    06-822-90C

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    1,884
    06-822-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-823-90C

    06-823-90C

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    4,144
    06-823-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    122-83-428-41-001101

    122-83-428-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,068
    122-83-428-41-001101

    规格书

    122 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-422-41-004101

    116-87-422-41-004101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,911
    116-87-422-41-004101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-316-WTT-3

    ICA-316-WTT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,352
    ICA-316-WTT-3

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    1-1437540-0

    1-1437540-0

    CONN IC DIP SOCKET 36POS GOLD

    TE Connectivity AMP Connectors

    3,025
    1-1437540-0

    规格书

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    ICA-308-WGT-2

    ICA-308-WGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,070
    ICA-308-WGT-2

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    115-83-650-41-001101

    115-83-650-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    4,274
    115-83-650-41-001101

    规格书

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0206-T-10

    HLS-0206-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,161
    HLS-0206-T-10

    规格书

    HLS Tube Active SIP 12 (2 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-87-632-41-002101

    116-87-632-41-002101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,983
    116-87-632-41-002101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    30-6511-10

    30-6511-10

    CONN IC DIP SOCKET 30POS TIN

    Aries Electronics

    1,434
    30-6511-10

    规格书

    511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7400-11

    02-7400-11

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    3,222
    02-7400-11

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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