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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    116-87-428-41-011101

    116-87-428-41-011101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,403
    116-87-428-41-011101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-632-41-012101

    116-83-632-41-012101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    1,252
    116-83-632-41-012101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    13-0517-90C

    13-0517-90C

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    4,049
    13-0517-90C

    规格书

    0517 Bulk Active SIP 13 (1 x 13) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    APA-308-T-C

    APA-308-T-C

    ADAPTER PLUG

    Samtec Inc.

    3,488
    APA-308-T-C

    规格书

    APA Bulk Active - 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-308-T-C

    APO-308-T-C

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,297
    APO-308-T-C

    规格书

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    510-83-068-09-001101

    510-83-068-09-001101

    CONN SOCKET PGA 68POS GOLD

    Preci-Dip

    2,020
    510-83-068-09-001101

    规格书

    510 Bulk Active PGA 68 (9 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-068-10-001101

    510-83-068-10-001101

    CONN SOCKET PGA 68POS GOLD

    Preci-Dip

    4,210
    510-83-068-10-001101

    规格书

    510 Bulk Active PGA 68 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-068-10-061101

    510-83-068-10-061101

    CONN SOCKET PGA 68POS GOLD

    Preci-Dip

    1,990
    510-83-068-10-061101

    规格书

    510 Bulk Active PGA 68 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-314-41-013101

    116-83-314-41-013101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    4,320
    116-83-314-41-013101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    122-87-632-41-001101

    122-87-632-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,629
    122-87-632-41-001101

    规格书

    122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-83-652-41-005101

    117-83-652-41-005101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    3,189
    117-83-652-41-005101

    规格书

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1-1437531-8

    1-1437531-8

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    3,056
    1-1437531-8

    规格书

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold - Copper Alloy - -55°C ~ 125°C
    HLS-0205-T-12

    HLS-0205-T-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,713
    HLS-0205-T-12

    规格书

    HLS Tube Active SIP 10 (2 x 5) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-87-628-41-011101

    116-87-628-41-011101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    1,397
    116-87-628-41-011101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0108-G-11

    HLS-0108-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,848
    HLS-0108-G-11

    规格书

    HLS Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    510-83-068-11-001101

    510-83-068-11-001101

    CONN SOCKET PGA 68POS GOLD

    Preci-Dip

    2,051
    510-83-068-11-001101

    规格书

    510 Bulk Active PGA 68 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-068-11-061101

    510-83-068-11-061101

    CONN SOCKET PGA 68POS GOLD

    Preci-Dip

    1,711
    510-83-068-11-061101

    规格书

    510 Bulk Active PGA 68 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-068-11-062101

    510-83-068-11-062101

    CONN SOCKET PGA 68POS GOLD

    Preci-Dip

    1,400
    510-83-068-11-062101

    规格书

    510 Bulk Active PGA 68 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-314-ZSGT-L

    ICA-314-ZSGT-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,870
    ICA-314-ZSGT-L

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    299-87-614-10-002101

    299-87-614-10-002101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    3,148
    299-87-614-10-002101

    规格书

    299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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