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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    116-83-628-41-008101

    116-83-628-41-008101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    1,900
    116-83-628-41-008101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    121-83-632-41-001101

    121-83-632-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,313
    121-83-632-41-001101

    规格书

    121 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    4-1571551-9

    4-1571551-9

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    2,863
    4-1571551-9

    规格书

    500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    14-8770-10WR

    14-8770-10WR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    4,377
    14-8770-10WR

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-8870-10WR

    14-8870-10WR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    4,297
    14-8870-10WR

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-0518-11

    25-0518-11

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    3,355
    25-0518-11

    规格书

    518 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-83-642-41-105101

    110-83-642-41-105101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    2,884
    110-83-642-41-105101

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-652-41-018101

    116-87-652-41-018101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    3,356
    116-87-652-41-018101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-87-648-41-105101

    117-87-648-41-105101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    3,130
    117-87-648-41-105101

    规格书

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-120-13-001101

    510-87-120-13-001101

    CONN SOCKET PGA 120POS GOLD

    Preci-Dip

    4,580
    510-87-120-13-001101

    规格书

    510 Bulk Active PGA 120 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-120-13-061101

    510-87-120-13-061101

    CONN SOCKET PGA 120POS GOLD

    Preci-Dip

    4,513
    510-87-120-13-061101

    规格书

    510 Bulk Active PGA 120 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-316-ATT

    ICA-316-ATT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,826
    ICA-316-ATT

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICO-316-ATT

    ICO-316-ATT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,590
    ICO-316-ATT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICA-308-ZSGG-L

    ICA-308-ZSGG-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,471
    ICA-308-ZSGG-L

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    3-1571586-0

    3-1571586-0

    CONN IC DIP SOCKET 32POS GOLD

    TE Connectivity AMP Connectors

    1,587
    3-1571586-0

    规格书

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    299-83-612-10-002101

    299-83-612-10-002101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    3,523
    299-83-612-10-002101

    规格书

    299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-314-TL-O

    ICF-314-TL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,852
    ICF-314-TL-O

    规格书

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    3-1437536-8

    3-1437536-8

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    3,694
    3-1437536-8

    规格书

    500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
    1-1571995-2

    1-1571995-2

    CONN SOCKET SIP 12POS GOLD

    TE Connectivity AMP Connectors

    1,913
    1-1571995-2

    规格书

    - Bulk Obsolete SIP 12 (1 x 12) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 20.0µin (0.51µm) Copper Thermoplastic, Polyester -
    31-0518-10H

    31-0518-10H

    CONN SOCKET SIP 31POS GOLD

    Aries Electronics

    1,485
    31-0518-10H

    规格书

    518 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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