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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    214-99-318-01-670799

    214-99-318-01-670799

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    3,620
    214-99-318-01-670799

    规格书

    214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    08-3503-20

    08-3503-20

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,571
    08-3503-20

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-3503-30

    08-3503-30

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,995
    08-3503-30

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-3513-10

    24-3513-10

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,263
    24-3513-10

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-3518-10M

    16-3518-10M

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,331
    16-3518-10M

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-83-632-41-801101

    110-83-632-41-801101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,865
    110-83-632-41-801101

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-652-41-005101

    110-83-652-41-005101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    3,332
    110-83-652-41-005101

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-83-636-41-001101

    612-83-636-41-001101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    3,066
    612-83-636-41-001101

    规格书

    612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-328-TL-O-TR

    ICF-328-TL-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,333
    ICF-328-TL-O-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    HLS-0109-T-32

    HLS-0109-T-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,468
    HLS-0109-T-32

    规格书

    HLS Tube Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    614-83-642-41-001101

    614-83-642-41-001101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    3,344
    614-83-642-41-001101

    规格书

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-121-11-000101

    510-87-121-11-000101

    CONN SOCKET PGA 121POS GOLD

    Preci-Dip

    1,315
    510-87-121-11-000101

    规格书

    510 Bulk Active PGA 121 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    10-6501-20

    10-6501-20

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    3,545
    10-6501-20

    规格书

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-6501-30

    10-6501-30

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    4,781
    10-6501-30

    规格书

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    ICA-316-WTT

    ICA-316-WTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,268
    ICA-316-WTT

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    124-83-324-41-002101

    124-83-324-41-002101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,997
    124-83-324-41-002101

    规格书

    124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-328-41-009101

    116-83-328-41-009101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,181
    116-83-328-41-009101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    214-99-320-01-670799

    214-99-320-01-670799

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    1,914
    214-99-320-01-670799

    规格书

    214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    214-44-320-01-670799

    214-44-320-01-670799

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    4,027
    214-44-320-01-670799

    规格书

    214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    122-83-628-41-001101

    122-83-628-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    1,396
    122-83-628-41-001101

    规格书

    122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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