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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    15-0511-10

    15-0511-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    4,852
    15-0511-10

    规格书

    511 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-820-90T

    18-820-90T

    CONN IC DIP SOCKET 18POS TIN

    Aries Electronics

    2,568
    18-820-90T

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    18-820-90TWR

    18-820-90TWR

    CONN IC DIP SOCKET 18POS TIN

    Aries Electronics

    1,286
    18-820-90TWR

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    HLS-0213-TT-10

    HLS-0213-TT-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,727
    HLS-0213-TT-10

    规格书

    HLS Tube Active SIP 26 (2 x 13) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    ICO-316-LGG

    ICO-316-LGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,778
    ICO-316-LGG

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    714-43-115-31-018000

    714-43-115-31-018000

    CONN SOCKET SIP 15POS GOLD

    Mill-Max Manufacturing Corp.

    4,710
    714-43-115-31-018000

    规格书

    714 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-83-640-41-008101

    116-83-640-41-008101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    3,217
    116-83-640-41-008101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-652-41-008101

    116-87-652-41-008101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    4,955
    116-87-652-41-008101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    XR2A-3211-N

    XR2A-3211-N

    CONN IC DIP SOCKET 32POS GOLD

    Omron Electronics Inc-EMC Div

    2,124
    XR2A-3211-N

    规格书

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    HLS-0114-T-10

    HLS-0114-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,756
    HLS-0114-T-10

    规格书

    HLS Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    122-83-640-41-001101

    122-83-640-41-001101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    2,408
    122-83-640-41-001101

    规格书

    122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    16-6501-20

    16-6501-20

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    2,774
    16-6501-20

    规格书

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICO-314-ZAGT

    ICO-314-ZAGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,644
    ICO-314-ZAGT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    510-83-101-11-001101

    510-83-101-11-001101

    CONN SOCKET PGA 101POS GOLD

    Preci-Dip

    2,902
    510-83-101-11-001101

    规格书

    510 Bulk Active PGA 101 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    16-0511-10

    16-0511-10

    CONN SOCKET SIP 16POS TIN

    Aries Electronics

    4,576
    16-0511-10

    规格书

    511 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    614-87-964-31-012101

    614-87-964-31-012101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    1,173
    614-87-964-31-012101

    规格书

    614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    48-6518-10T

    48-6518-10T

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    3,140
    48-6518-10T

    规格书

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICF-328-TL-O

    ICF-328-TL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,179
    ICF-328-TL-O

    规格书

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-328-TL-I

    ICF-328-TL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,476
    ICF-328-TL-I

    规格书

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-628-TL-I

    ICF-628-TL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,842
    ICF-628-TL-I

    规格书

    ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
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