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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APO-320-T-T

    APO-320-T-T

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,085
    APO-320-T-T

    规格书

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    510-83-121-15-001101

    510-83-121-15-001101

    CONN SOCKET PGA 121POS GOLD

    Preci-Dip

    3,242
    510-83-121-15-001101

    规格书

    510 Bulk Active PGA 121 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-121-15-061101

    510-83-121-15-061101

    CONN SOCKET PGA 121POS GOLD

    Preci-Dip

    1,955
    510-83-121-15-061101

    规格书

    510 Bulk Active PGA 121 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-648-41-001101

    116-83-648-41-001101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    3,050
    116-83-648-41-001101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0311-T-2

    HLS-0311-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,387
    HLS-0311-T-2

    规格书

    HLS Tube Active SIP 33 (3 x 11) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    HLS-0212-T-22

    HLS-0212-T-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,784
    HLS-0212-T-22

    规格书

    HLS Tube Active SIP 24 (2 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    18-6503-20

    18-6503-20

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,758
    18-6503-20

    规格书

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-6503-30

    18-6503-30

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,440
    18-6503-30

    规格书

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-0314-TT-11

    HLS-0314-TT-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,925
    HLS-0314-TT-11

    规格书

    HLS Tube Active SIP 42 (3 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    ICA-628-KGT

    ICA-628-KGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,305
    ICA-628-KGT

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    299-87-628-10-002101

    299-87-628-10-002101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,750
    299-87-628-10-002101

    规格书

    299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    35-0518-11H

    35-0518-11H

    CONN SOCKET SIP 35POS GOLD

    Aries Electronics

    3,835
    35-0518-11H

    规格书

    518 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    40-0518-11H

    40-0518-11H

    CONN SOCKET SIP 40POS GOLD

    Aries Electronics

    3,925
    40-0518-11H

    规格书

    518 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    AR64-HZW/T-R

    AR64-HZW/T-R

    CONN IC DIP SOCKET 64POS GOLD

    Assmann WSW Components

    3,120
    AR64-HZW/T-R

    规格书

    - Tube Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    110-41-304-41-105000

    110-41-304-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,826
    110-41-304-41-105000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-304-41-105000

    110-91-304-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,771
    110-91-304-41-105000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0208-T-32

    HLS-0208-T-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,376
    HLS-0208-T-32

    规格书

    HLS Tube Active SIP 16 (2 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    714-43-212-31-018000

    714-43-212-31-018000

    CONN IC DIP SOCKET 12POS GOLD

    Mill-Max Manufacturing Corp.

    2,569
    714-43-212-31-018000

    规格书

    714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    20-3503-20

    20-3503-20

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,718
    20-3503-20

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-C300-10

    40-C300-10

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    1,882
    40-C300-10

    规格书

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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