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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    ICO-422-LGG

    ICO-422-LGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,488
    ICO-422-LGG

    规格书

    ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-320-ZAGT

    ICO-320-ZAGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,973
    ICO-320-ZAGT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    PGA132H004B1-1414R

    PGA132H004B1-1414R

    PGA SOCKET 132 CTS

    Amphenol ICC (FCI)

    1,401
    PGA132H004B1-1414R

    规格书

    - - Active PGA 132 (14 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
    12-81250-610C

    12-81250-610C

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    1,088
    12-81250-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-8260-610C

    12-8260-610C

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,235
    12-8260-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-8300-610C

    12-8300-610C

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,913
    12-8300-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    XR2T-2421-N

    XR2T-2421-N

    CONN IC DIP SOCKET 24POS GOLD

    Omron Electronics Inc-EMC Div

    2,859
    XR2T-2421-N

    规格书

    XR2 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Threaded Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    510-87-209-17-001101

    510-87-209-17-001101

    CONN SOCKET PGA 209POS GOLD

    Preci-Dip

    2,558
    510-87-209-17-001101

    规格书

    510 Bulk Active PGA 209 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-209-17-062101

    510-87-209-17-062101

    CONN SOCKET PGA 209POS GOLD

    Preci-Dip

    3,212
    510-87-209-17-062101

    规格书

    510 Bulk Active PGA 209 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-209-17-063101

    510-87-209-17-063101

    CONN SOCKET PGA 209POS GOLD

    Preci-Dip

    3,385
    510-87-209-17-063101

    规格书

    510 Bulk Active PGA 209 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-237-17-061101

    510-87-237-17-061101

    CONN SOCKET PGA 237POS GOLD

    Preci-Dip

    2,293
    510-87-237-17-061101

    规格书

    510 Bulk Active PGA 237 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0207-G-32

    HLS-0207-G-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,310
    HLS-0207-G-32

    规格书

    HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    HLS-0407-S-2

    HLS-0407-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,670
    HLS-0407-S-2

    规格书

    HLS Bulk Active SIP 28 (4 x 7) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    614-41-304-41-001000

    614-41-304-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,421
    614-41-304-41-001000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-304-41-001000

    614-91-304-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,096
    614-91-304-41-001000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0117-G-10

    HLS-0117-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,216
    HLS-0117-G-10

    规格书

    HLS Tube Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    13-0503-20

    13-0503-20

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    3,795
    13-0503-20

    规格书

    0503 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    HLS-0306-T-12

    HLS-0306-T-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,325
    HLS-0306-T-12

    规格书

    HLS Tube Active SIP 18 (3 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    510-87-210-17-061101

    510-87-210-17-061101

    CONN SOCKET PGA 210POS GOLD

    Preci-Dip

    4,243
    510-87-210-17-061101

    规格书

    510 Bulk Active PGA 210 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-516-10

    28-516-10

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    2,240
    28-516-10

    规格书

    516 Bulk Obsolete DIP, ZIF (ZIP) 28 (2 x 14) 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
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