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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    ICF-640-S-I-TR

    ICF-640-S-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,821
    ICF-640-S-I-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    614-41-304-31-007000

    614-41-304-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    1,589
    614-41-304-31-007000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-304-31-007000

    614-91-304-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    1,483
    614-91-304-31-007000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    2229490-2

    2229490-2

    CONN SOCKET PGA ZIF 947POS GOLD

    TE Connectivity AMP Connectors

    1,647
    2229490-2

    规格书

    - Tape & Reel (TR) Active PGA, ZIF (ZIP) 947 (35 x 36) 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039" (1.00mm) Tin-Lead 15.0µin (0.38µm) Copper Alloy Thermoplastic -
    HLS-0505-T-2

    HLS-0505-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,787
    HLS-0505-T-2

    规格书

    HLS Bulk Active SIP 25 (5 x 5) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    40-6518-10M

    40-6518-10M

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,993
    40-6518-10M

    规格书

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-650-41-002101

    116-83-650-41-002101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    2,604
    116-83-650-41-002101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-208-17-081101

    510-87-208-17-081101

    CONN SOCKET PGA 208POS GOLD

    Preci-Dip

    4,041
    510-87-208-17-081101

    规格书

    510 Bulk Active PGA 208 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-3511-11

    20-3511-11

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,393
    20-3511-11

    规格书

    511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    HLS-0119-T-10

    HLS-0119-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,842
    HLS-0119-T-10

    规格书

    HLS Tube Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    APH-1908-T-R

    APH-1908-T-R

    APH-1908-T-R

    Samtec Inc.

    4,034
    APH-1908-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0408-T-R

    APH-0408-T-R

    APH-0408-T-R

    Samtec Inc.

    3,642
    APH-0408-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0908-T-R

    APH-0908-T-R

    APH-0908-T-R

    Samtec Inc.

    1,109
    APH-0908-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    510-87-236-17-062101

    510-87-236-17-062101

    CONN SOCKET PGA 236POS GOLD

    Preci-Dip

    1,618
    510-87-236-17-062101

    规格书

    510 Bulk Active PGA 236 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-41-304-31-018000

    614-41-304-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,765
    614-41-304-31-018000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-304-31-018000

    614-91-304-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,971
    614-91-304-31-018000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6518-112

    32-6518-112

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,560
    32-6518-112

    规格书

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICA-316-AGG

    ICA-316-AGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,889
    ICA-316-AGG

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    XR2A-4001-N

    XR2A-4001-N

    CONN IC DIP SOCKET 40POS GOLD

    Omron Electronics Inc-EMC Div

    3,765
    XR2A-4001-N

    规格书

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    ICO-322-LGG

    ICO-322-LGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,156
    ICO-322-LGG

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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