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| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
510-83-169-13-000101CONN SOCKET PGA 169POS GOLD |
2,151 |
|
规格书 |
510 | Bulk | Active | PGA | 169 (13 x 13) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
510-83-153-15-061101CONN SOCKET PGA 153POS GOLD |
3,494 |
|
规格书 |
510 | Bulk | Active | PGA | 153 (15 x 15) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
714-43-127-31-018000CONN SOCKET SIP 27POS GOLD |
2,016 |
|
规格书 |
714 | Bulk | Active | SIP | 27 (1 x 27) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
APH-0510-T-RAPH-0510-T-R |
2,599 |
|
规格书 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1010-T-RAPH-1010-T-R |
1,946 |
|
规格书 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0210-T-RAPH-0210-T-R |
4,934 |
|
规格书 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1210-T-RAPH-1210-T-R |
1,833 |
|
规格书 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0310-T-RAPH-0310-T-R |
1,362 |
|
规格书 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
ICA-324-ZWGT-3.100" SCREW MACHINE DIP SOCKET |
4,311 |
|
规格书 |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
|
|
864-AG10DCONN IC DIP SOCKET 64POS GOLD |
4,469 |
|
规格书 |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
|
|
510-87-280-19-081101CONN SOCKET PGA 280POS GOLD |
4,414 |
|
规格书 |
510 | Bulk | Active | PGA | 280 (19 x 19) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
HLS-0116-G-32.100" SCREW MACHINE SOCKET ARRAY |
3,665 |
|
规格书 |
HLS | Tube | Active | SIP | 16 (1 x 16) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Thermoplastic | -55°C ~ 140°C |
|
|
AW 226-20/GPIN HEADER |
4,084 |
|
规格书 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
546-83-068-11-061135CONN SOCKET PGA 68POS GOLD |
4,423 |
|
规格书 |
546 | Bulk | Active | PGA | 68 (11 x 11) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
546-83-068-11-061136CONN SOCKET PGA 68POS GOLD |
4,864 |
|
规格书 |
546 | Bulk | Active | PGA | 68 (11 x 11) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
510-83-169-17-101101CONN SOCKET PGA 169POS GOLD |
2,053 |
|
规格书 |
510 | Bulk | Active | PGA | 169 (17 x 17) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
20-823-90TWRCONN IC DIP SOCKET 20POS TIN |
2,674 |
|
规格书 |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
|
|
22-6823-90TCONN IC DIP SOCKET 22POS TIN |
2,209 |
|
规格书 |
Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
|
|
614-87-069-11-061112CONN SOCKET PGA 69POS GOLD |
2,023 |
|
规格书 |
614 | Bulk | Active | PGA | 69 (11 x 11) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
510-87-281-19-081101CONN SOCKET PGA 281POS GOLD |
2,487 |
|
规格书 |
510 | Bulk | Active | PGA | 281 (19 x 19) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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