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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    08-6810-90

    08-6810-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    1,370
    08-6810-90

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    116-87-640-41-013101

    116-87-640-41-013101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    2,390
    116-87-640-41-013101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-320-WGG-2

    ICA-320-WGG-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,839
    ICA-320-WGG-2

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-318-CGG

    ICO-318-CGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,024
    ICO-318-CGG

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    APA-314-G-M

    APA-314-G-M

    ADAPTER PLUG

    Samtec Inc.

    4,607
    APA-314-G-M

    规格书

    APA Tube Active - 14 (2 x 7) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICF-322-STL-I

    ICF-322-STL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,961
    ICF-322-STL-I

    规格书

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    APA-324-T-P

    APA-324-T-P

    ADAPTER PLUG

    Samtec Inc.

    4,984
    APA-324-T-P

    规格书

    APA Tube Active - 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APA-624-T-P

    APA-624-T-P

    ADAPTER PLUG

    Samtec Inc.

    4,039
    APA-624-T-P

    规格书

    APA Tube Active - 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICA-648-WTT-3

    ICA-648-WTT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,241
    ICA-648-WTT-3

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    346-93-135-41-013000

    346-93-135-41-013000

    CONN SOCKET SIP 35POS GOLD

    Mill-Max Manufacturing Corp.

    4,091
    346-93-135-41-013000

    规格书

    346 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-135-41-013000

    346-43-135-41-013000

    CONN SOCKET SIP 35POS GOLD

    Mill-Max Manufacturing Corp.

    2,730
    346-43-135-41-013000

    规格书

    346 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-320-ZCGG

    ICO-320-ZCGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,378
    ICO-320-ZCGG

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-422-ZCGT

    ICO-422-ZCGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,702
    ICO-422-ZCGT

    规格书

    ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    1107659-01

    1107659-01

    700 ELEVATOR STRIP-LINE SOCKET

    Aries Electronics

    1,374
    1107659-01

    规格书

    - - Active - - - - - - - - - - - - - - -
    32-9513-11

    32-9513-11

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,766
    32-9513-11

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    34-3513-10H

    34-3513-10H

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    1,710
    34-3513-10H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-C182-11H

    24-C182-11H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,251
    24-C182-11H

    规格书

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-81000-310C

    16-81000-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,127
    16-81000-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-81100-310C

    16-81100-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    1,882
    16-81100-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-81150-310C

    16-81150-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,028
    16-81150-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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