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    16-8560-310C

    16-8560-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,892
    16-8560-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8561-310C

    16-8561-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    1,505
    16-8561-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8590-310C

    16-8590-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,846
    16-8590-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8600-310C

    16-8600-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,717
    16-8600-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8608-310C

    16-8608-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,048
    16-8608-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8620-310C

    16-8620-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,090
    16-8620-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8625-310C

    16-8625-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,305
    16-8625-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8633-310C

    16-8633-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,257
    16-8633-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8720-310C

    16-8720-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,370
    16-8720-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8750-310C

    16-8750-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    1,080
    16-8750-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8800-310C

    16-8800-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    1,288
    16-8800-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8810-310C

    16-8810-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,202
    16-8810-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8850-310C

    16-8850-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,148
    16-8850-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8990-310C

    16-8990-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,132
    16-8990-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-0310-T-11

    HLS-0310-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,216
    HLS-0310-T-11

    规格书

    HLS Tube Active SIP 30 (3 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    HLS-0406-T-2

    HLS-0406-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,685
    HLS-0406-T-2

    规格书

    HLS Bulk Active SIP 24 (4 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    117-93-664-41-005000

    117-93-664-41-005000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    3,780
    117-93-664-41-005000

    规格书

    117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-640-WTT-2

    ICA-640-WTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,843
    ICA-640-WTT-2

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    3-1825046-0

    3-1825046-0

    CONN IC DIP SOCKET 32POS GOLD

    TE Connectivity AMP Connectors

    4,875
    3-1825046-0

    规格书

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) - - Brass - -
    ICA-648-WTT-2

    ICA-648-WTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,847
    ICA-648-WTT-2

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
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