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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    16-3503-31

    16-3503-31

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,749
    16-3503-31

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    30-3503-20

    30-3503-20

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    3,742
    30-3503-20

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-3503-30

    30-3503-30

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    1,464
    30-3503-30

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    210-11-310-41-001000

    210-11-310-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,095
    210-11-310-41-001000

    规格书

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-306-41-007000

    116-93-306-41-007000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    2,085
    116-93-306-41-007000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-306-41-007000

    116-43-306-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,138
    116-43-306-41-007000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0317-T-2

    HLS-0317-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,435
    HLS-0317-T-2

    规格书

    HLS Tube Active SIP 51 (3 x 17) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    546-83-085-11-002135

    546-83-085-11-002135

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    1,764
    546-83-085-11-002135

    规格书

    546 Bulk Active PGA 85 (11 x 11) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-83-085-11-002136

    546-83-085-11-002136

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    3,513
    546-83-085-11-002136

    规格书

    546 Bulk Active PGA 85 (11 x 11) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-810-90TWR

    20-810-90TWR

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    3,273
    20-810-90TWR

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    146-41-308-41-012000

    146-41-308-41-012000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    4,827
    146-41-308-41-012000

    规格书

    146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-91-308-41-012000

    146-91-308-41-012000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    1,315
    146-91-308-41-012000

    规格书

    146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-13-306-41-770000

    104-13-306-41-770000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    3,097
    104-13-306-41-770000

    规格书

    104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    110-43-210-41-001000

    110-43-210-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,540
    110-43-210-41-001000

    规格书

    110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-320-ZWGG-2

    ICA-320-ZWGG-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,409
    ICA-320-ZWGG-2

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICF-328-STL-I

    ICF-328-STL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,425
    ICF-328-STL-I

    规格书

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-628-STL-O

    ICF-628-STL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,900
    ICF-628-STL-O

    规格书

    ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-648-TL-O

    ICF-648-TL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,227
    ICF-648-TL-O

    规格书

    ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    APH-0918-T-T

    APH-0918-T-T

    APH-0918-T-T

    Samtec Inc.

    2,433
    APH-0918-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1018-T-T

    APH-1018-T-T

    APH-1018-T-T

    Samtec Inc.

    3,485
    APH-1018-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
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