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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    614-91-306-31-002000

    614-91-306-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    1,225
    614-91-306-31-002000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-628-NGG

    ICO-628-NGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,524
    ICO-628-NGG

    规格书

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    104-13-306-41-780000

    104-13-306-41-780000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    4,944
    104-13-306-41-780000

    规格书

    104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    ICO-632-ZLGG

    ICO-632-ZLGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,150
    ICO-632-ZLGG

    规格书

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    114-93-310-41-117000

    114-93-310-41-117000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    1,919
    114-93-310-41-117000

    规格书

    114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-43-310-41-117000

    114-43-310-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,144
    114-43-310-41-117000

    规格书

    114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-41-314-41-001000

    115-41-314-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,963
    115-41-314-41-001000

    规格书

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-91-314-41-001000

    115-91-314-41-001000

    SKT IC OPEN LOWPRO

    Mill-Max Manufacturing Corp.

    2,384
    115-91-314-41-001000

    规格书

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-306-41-001000

    116-47-306-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,032
    116-47-306-41-001000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-6556-10

    28-6556-10

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,009
    28-6556-10

    规格书

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    ICA-640-SGG-L

    ICA-640-SGG-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,951
    ICA-640-SGG-L

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    614-41-306-31-018000

    614-41-306-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,727
    614-41-306-31-018000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-306-31-018000

    614-91-306-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,783
    614-91-306-31-018000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-306-41-008000

    116-93-306-41-008000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    3,733
    116-93-306-41-008000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-306-41-008000

    116-43-306-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,317
    116-43-306-41-008000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    10-0511-11

    10-0511-11

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    4,387
    10-0511-11

    规格书

    511 Tube Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    APH-1822-T-R

    APH-1822-T-R

    APH-1822-T-R

    Samtec Inc.

    2,983
    APH-1822-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1422-T-R

    APH-1422-T-R

    APH-1422-T-R

    Samtec Inc.

    4,755
    APH-1422-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0522-T-R

    APH-0522-T-R

    APH-0522-T-R

    Samtec Inc.

    1,827
    APH-0522-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1022-T-R

    APH-1022-T-R

    APH-1022-T-R

    Samtec Inc.

    1,870
    APH-1022-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
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