您好,欢迎来到双灏业商城!
    双灏业商城0755-83179664

    IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-1718-T-T

    APH-1718-T-T

    APH-1718-T-T

    Samtec Inc.

    1,128
    APH-1718-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0718-T-T

    APH-0718-T-T

    APH-0718-T-T

    Samtec Inc.

    2,183
    APH-0718-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0318-T-T

    APH-0318-T-T

    APH-0318-T-T

    Samtec Inc.

    2,531
    APH-0318-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    116-41-308-41-006000

    116-41-308-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,106
    116-41-308-41-006000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-308-41-006000

    116-91-308-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,940
    116-91-308-41-006000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-41-103-41-005000

    917-41-103-41-005000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    4,382
    917-41-103-41-005000

    规格书

    917 Tube Active Transistor, TO-5 3 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-91-103-41-005000

    917-91-103-41-005000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    2,089
    917-91-103-41-005000

    规格书

    917 Tube Active Transistor, TO-5 3 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-83-642-41-013101

    116-83-642-41-013101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    4,299
    116-83-642-41-013101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    30-9513-10H

    30-9513-10H

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,231
    30-9513-10H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-99-322-41-001000

    110-99-322-41-001000

    CONN IC DIP SOCKET 22POS TINLEAD

    Mill-Max Manufacturing Corp.

    1,258
    110-99-322-41-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-44-322-41-001000

    110-44-322-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,596
    110-44-322-41-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-44-422-41-001000

    110-44-422-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,208
    110-44-422-41-001000

    规格书

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-41-103-41-001000

    917-41-103-41-001000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    4,251
    917-41-103-41-001000

    规格书

    917 Tube Active Transistor, TO-5 3 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-11-308-41-001000

    210-11-308-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,634
    210-11-308-41-001000

    规格书

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0313-T-10

    HLS-0313-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,415
    HLS-0313-T-10

    规格书

    HLS Tube Active SIP 39 (3 x 13) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    20-3508-30

    20-3508-30

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,176
    20-3508-30

    规格书

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8450-610C

    16-8450-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,633
    16-8450-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8500-610C

    16-8500-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,638
    16-8500-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-0410-T-2

    HLS-0410-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,293
    HLS-0410-T-2

    规格书

    HLS Bulk Active SIP 40 (4 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    210-99-324-41-001000

    210-99-324-41-001000

    CONN IC DIP SOCKET 24POS TINLEAD

    Mill-Max Manufacturing Corp.

    4,549
    210-99-324-41-001000

    规格书

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    联系我们 获取更多产品资讯!
    双灏业商城

    首页

    双灏业商城

    产品中心

    双灏业商城

    电话

    双灏业商城

    会员中心

    品种齐全,轻松购物
    品种齐全,轻松购物
    多仓直发,极速配送
    多仓直发,极速配送
    正品行货,精致服务
    正品行货,精致服务
    天天低价,畅选无忧
    天天低价,畅选无忧
    版权所有©2025 双灏业商城