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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    210-99-624-41-001000

    210-99-624-41-001000

    CONN IC DIP SOCKET 24POS TINLEAD

    Mill-Max Manufacturing Corp.

    3,868
    210-99-624-41-001000

    规格书

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-44-324-41-001000

    210-44-324-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,693
    210-44-324-41-001000

    规格书

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-44-624-41-001000

    210-44-624-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,862
    210-44-624-41-001000

    规格书

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    65-PGM10008-10

    65-PGM10008-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,233
    65-PGM10008-10

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    1-2013620-2

    1-2013620-2

    CONN SOCKET PGA ZIF 988POS GOLD

    TE Connectivity AMP Connectors

    2,579
    1-2013620-2

    规格书

    - Tape & Reel (TR) Obsolete PGA, ZIF (ZIP) 988 (35 x 36) 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039" (1.00mm) - - Copper Alloy Thermoplastic -
    110-93-210-41-105000

    110-93-210-41-105000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    2,197
    110-93-210-41-105000

    规格书

    110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-221-18-091101

    510-83-221-18-091101

    CONN SOCKET PGA 221POS GOLD

    Preci-Dip

    2,250
    510-83-221-18-091101

    规格书

    510 Bulk Active PGA 221 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-624-ZHGT

    ICA-624-ZHGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,657
    ICA-624-ZHGT

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-41-210-41-006000

    116-41-210-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,535
    116-41-210-41-006000

    规格书

    116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-210-41-006000

    116-91-210-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,707
    116-91-210-41-006000

    规格书

    116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-628-ZSGG-L

    ICA-628-ZSGG-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,930
    ICA-628-ZSGG-L

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICF-648-FM-O

    ICF-648-FM-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,530
    ICF-648-FM-O

    规格书

    ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-648-F-O

    ICF-648-F-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,861
    ICF-648-F-O

    规格书

    ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    714-43-135-31-018000

    714-43-135-31-018000

    CONN SOCKET SIP 35POS GOLD

    Mill-Max Manufacturing Corp.

    3,717
    714-43-135-31-018000

    规格书

    714 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    30-820-90C

    30-820-90C

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    1,999
    30-820-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-822-90C

    30-822-90C

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    1,847
    30-822-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-823-90C

    30-823-90C

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,239
    30-823-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    37-PGM10012-10

    37-PGM10012-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,654
    37-PGM10012-10

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    510-87-361-19-000101

    510-87-361-19-000101

    CONN SOCKET PGA 361POS GOLD

    Preci-Dip

    3,555
    510-87-361-19-000101

    规格书

    510 Bulk Active PGA 361 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-81000-610C

    20-81000-610C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,811
    20-81000-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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