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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-0328-T-R

    APH-0328-T-R

    APH-0328-T-R

    Samtec Inc.

    1,258
    APH-0328-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1728-T-R

    APH-1728-T-R

    APH-1728-T-R

    Samtec Inc.

    4,985
    APH-1728-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0828-T-R

    APH-0828-T-R

    APH-0828-T-R

    Samtec Inc.

    4,154
    APH-0828-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1328-T-R

    APH-1328-T-R

    APH-1328-T-R

    Samtec Inc.

    4,815
    APH-1328-T-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    117-47-430-41-005000

    117-47-430-41-005000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    2,614
    117-47-430-41-005000

    规格书

    117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-93-158-41-013000

    346-93-158-41-013000

    CONN SOCKET SIP 58POS GOLD

    Mill-Max Manufacturing Corp.

    1,624
    346-93-158-41-013000

    规格书

    346 Bulk Active SIP 58 (1 x 58) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-158-41-013000

    346-43-158-41-013000

    CONN SOCKET SIP 58POS GOLD

    Mill-Max Manufacturing Corp.

    3,280
    346-43-158-41-013000

    规格书

    346 Bulk Active SIP 58 (1 x 58) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    18-820-90

    18-820-90

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,529
    18-820-90

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    18-822-90

    18-822-90

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    1,805
    18-822-90

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    26-8450-310C

    26-8450-310C

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    4,437
    26-8450-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    26-8500-310C

    26-8500-310C

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    3,772
    26-8500-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    111-41-642-41-001000

    111-41-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,548
    111-41-642-41-001000

    规格书

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-91-642-41-001000

    111-91-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,425
    111-91-642-41-001000

    规格书

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-320-41-001000

    614-41-320-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    1,482
    614-41-320-41-001000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-420-41-001000

    614-41-420-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,134
    614-41-420-41-001000

    规格书

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-320-41-001000

    614-91-320-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,224
    614-91-320-41-001000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-420-41-001000

    614-91-420-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,720
    614-91-420-41-001000

    规格书

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-640-T-H

    APO-640-T-H

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,929
    APO-640-T-H

    规格书

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    123-13-210-41-001000

    123-13-210-41-001000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    4,484
    123-13-210-41-001000

    规格书

    123 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-41-636-41-117000

    114-41-636-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,632
    114-41-636-41-117000

    规格书

    114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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