您好,欢迎来到双灏业商城!
    双灏业商城0755-83179664

    IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    116-93-950-61-007000

    116-93-950-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,766
    116-93-950-61-007000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    558-10-192M16-001104

    558-10-192M16-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    4,937
    558-10-192M16-001104

    规格书

    558 Bulk Active BGA 192 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    550-80-296-19-131135

    550-80-296-19-131135

    PGA SOLDER TAIL

    Preci-Dip

    2,390
    550-80-296-19-131135

    规格书

    550 Bulk Active PGA 296 (19 x 19) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-43-964-61-006000

    116-43-964-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,140
    116-43-964-61-006000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-964-61-006000

    116-93-964-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,531
    116-93-964-61-006000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    518-77-192M16-001105

    518-77-192M16-001105

    CONN SOCKET PGA 192POS GOLD

    Preci-Dip

    1,233
    518-77-192M16-001105

    规格书

    518 Bulk Active PGA 192 (16 x 16) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    APH-0434-G-H

    APH-0434-G-H

    APH-0434-G-H

    Samtec Inc.

    3,575
    APH-0434-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1834-G-H

    APH-1834-G-H

    APH-1834-G-H

    Samtec Inc.

    1,175
    APH-1834-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1534-G-H

    APH-1534-G-H

    APH-1534-G-H

    Samtec Inc.

    2,152
    APH-1534-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1234-G-H

    APH-1234-G-H

    APH-1234-G-H

    Samtec Inc.

    2,234
    APH-1234-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0234-G-H

    APH-0234-G-H

    APH-0234-G-H

    Samtec Inc.

    3,715
    APH-0234-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0734-G-H

    APH-0734-G-H

    APH-0734-G-H

    Samtec Inc.

    2,876
    APH-0734-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0834-G-H

    APH-0834-G-H

    APH-0834-G-H

    Samtec Inc.

    2,232
    APH-0834-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APA-640-G-Q

    APA-640-G-Q

    ADAPTER PLUG

    Samtec Inc.

    1,533
    APA-640-G-Q

    规格书

    APA Tube Active - 40 (2 x 20) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APA-640-G-C

    APA-640-G-C

    ADAPTER PLUG

    Samtec Inc.

    3,971
    APA-640-G-C

    规格书

    APA Bulk Active - 40 (2 x 20) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-640-G-C

    APO-640-G-C

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,258
    APO-640-G-C

    规格书

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    48-6503-31

    48-6503-31

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    2,375
    48-6503-31

    规格书

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    APH-1828-G-T

    APH-1828-G-T

    APH-1828-G-T

    Samtec Inc.

    4,101
    APH-1828-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1428-G-T

    APH-1428-G-T

    APH-1428-G-T

    Samtec Inc.

    4,383
    APH-1428-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1528-G-T

    APH-1528-G-T

    APH-1528-G-T

    Samtec Inc.

    4,612
    APH-1528-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    联系我们 获取更多产品资讯!
    双灏业商城

    首页

    双灏业商城

    产品中心

    双灏业商城

    电话

    双灏业商城

    会员中心

    品种齐全,轻松购物
    品种齐全,轻松购物
    多仓直发,极速配送
    多仓直发,极速配送
    正品行货,精致服务
    正品行货,精致服务
    天天低价,畅选无忧
    天天低价,畅选无忧
    版权所有©2025 双灏业商城