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    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-1928-G-T

    APH-1928-G-T

    APH-1928-G-T

    Samtec Inc.

    4,911
    APH-1928-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0228-G-T

    APH-0228-G-T

    APH-0228-G-T

    Samtec Inc.

    1,719
    APH-0228-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1128-G-T

    APH-1128-G-T

    APH-1128-G-T

    Samtec Inc.

    4,864
    APH-1128-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0328-G-T

    APH-0328-G-T

    APH-0328-G-T

    Samtec Inc.

    2,161
    APH-0328-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    116-43-952-61-007000

    116-43-952-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,213
    116-43-952-61-007000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-952-61-007000

    116-93-952-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,584
    116-93-952-61-007000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-1926-G-R

    APH-1926-G-R

    APH-1926-G-R

    Samtec Inc.

    4,280
    APH-1926-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1426-G-R

    APH-1426-G-R

    APH-1426-G-R

    Samtec Inc.

    2,650
    APH-1426-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0326-G-R

    APH-0326-G-R

    APH-0326-G-R

    Samtec Inc.

    3,411
    APH-0326-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1726-G-R

    APH-1726-G-R

    APH-1726-G-R

    Samtec Inc.

    4,105
    APH-1726-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0226-G-R

    APH-0226-G-R

    APH-0226-G-R

    Samtec Inc.

    1,294
    APH-0226-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1226-G-R

    APH-1226-G-R

    APH-1226-G-R

    Samtec Inc.

    1,153
    APH-1226-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    HLS-0420-T-12

    HLS-0420-T-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,886
    HLS-0420-T-12

    规格书

    HLS Bulk Active SIP 80 (4 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-43-648-61-001000

    116-43-648-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,971
    116-43-648-61-001000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-648-61-001000

    116-93-648-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,198
    116-93-648-61-001000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-C300-21

    40-C300-21

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,076
    40-C300-21

    规格书

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    42-3570-11

    42-3570-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    2,789
    42-3570-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3571-11

    42-3571-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    4,717
    42-3571-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3572-11

    42-3572-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    2,219
    42-3572-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3573-11

    42-3573-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    3,944
    42-3573-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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