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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    220-2600-50-0602

    220-2600-50-0602

    3M TEXTOOL ZIP STRIP SOCKETS 220

    3M

    4,586
    220-2600-50-0602

    规格书

    Textool™ Box Active SIP, ZIF (ZIP) 20 (1 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    518-77-256M16-000105

    518-77-256M16-000105

    CONN SOCKET PGA 256POS GOLD

    Preci-Dip

    2,093
    518-77-256M16-000105

    规格书

    518 Bulk Active PGA 256 (16 x 16) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    518-77-256M20-001105

    518-77-256M20-001105

    CONN SOCKET PGA 256POS GOLD

    Preci-Dip

    3,704
    518-77-256M20-001105

    规格书

    518 Bulk Active PGA 256 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    514-87-400M20-000148

    514-87-400M20-000148

    CONN SOCKET BGA 400POS GOLD

    Preci-Dip

    3,245
    514-87-400M20-000148

    规格书

    514 Bulk Active BGA 400 (20 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    550-10-292M20-001152

    550-10-292M20-001152

    BGA SOLDER TAIL

    Preci-Dip

    4,112
    550-10-292M20-001152

    规格书

    550 Bulk Active BGA 292 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    APH-1136-G-R

    APH-1136-G-R

    APH-1136-G-R

    Samtec Inc.

    1,824
    APH-1136-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1236-G-R

    APH-1236-G-R

    APH-1236-G-R

    Samtec Inc.

    3,784
    APH-1236-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1736-G-R

    APH-1736-G-R

    APH-1736-G-R

    Samtec Inc.

    4,452
    APH-1736-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1336-G-R

    APH-1336-G-R

    APH-1336-G-R

    Samtec Inc.

    1,905
    APH-1336-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    550-10-420M26-001166

    550-10-420M26-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    3,170
    550-10-420M26-001166

    规格书

    550 Bulk Active BGA 420 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    2100-7243-00-1807

    2100-7243-00-1807

    CONN SOCKET PQFP 100POS TIN-LEAD

    3M

    1,135
    2100-7243-00-1807

    规格书

    OEM Bulk Obsolete QFP 100 (4 x 25) - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Polyethersulfone (PES), Glass Filled 0°C ~ 105°C
    614-87-296-19-131144

    614-87-296-19-131144

    CONN SOCKET PGA 296POS GOLD

    Preci-Dip

    3,167
    614-87-296-19-131144

    规格书

    614 Bulk Active PGA 296 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-87-447-20-121147

    546-87-447-20-121147

    CONN SOCKET PGA 447POS GOLD

    Preci-Dip

    3,428
    546-87-447-20-121147

    规格书

    546 Bulk Active PGA 447 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    518-77-255M16-001106

    518-77-255M16-001106

    CONN SOCKET PGA 255POS GOLD

    Preci-Dip

    2,642
    518-77-255M16-001106

    规格书

    518 Bulk Active PGA 255 (16 x 16) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    239-5605-02-0602

    239-5605-02-0602

    CONN ZIG-ZAG 39POS GOLD

    3M

    1,927
    239-5605-02-0602

    规格书

    - Bulk Obsolete Zig-Zag 39 (1 x 19, 1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 150°C
    510-91-324-18-000001

    510-91-324-18-000001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    4,709
    510-91-324-18-000001

    规格书

    510 Bulk Active PGA 324 (18 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    518-77-256M16-000106

    518-77-256M16-000106

    CONN SOCKET PGA 256POS GOLD

    Preci-Dip

    4,763
    518-77-256M16-000106

    规格书

    518 Bulk Active PGA 256 (16 x 16) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    518-77-256M20-001106

    518-77-256M20-001106

    CONN SOCKET PGA 256POS GOLD

    Preci-Dip

    4,689
    518-77-256M20-001106

    规格书

    518 Bulk Active PGA 256 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    64-9503-21

    64-9503-21

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    4,157
    64-9503-21

    规格书

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    64-9503-31

    64-9503-31

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    1,720
    64-9503-31

    规格书

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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