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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-0938-G-H

    APH-0938-G-H

    APH-0938-G-H

    Samtec Inc.

    3,128
    APH-0938-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1738-G-H

    APH-1738-G-H

    APH-1738-G-H

    Samtec Inc.

    1,482
    APH-1738-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0438-G-H

    APH-0438-G-H

    APH-0438-G-H

    Samtec Inc.

    1,028
    APH-0438-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1138-G-H

    APH-1138-G-H

    APH-1138-G-H

    Samtec Inc.

    3,692
    APH-1138-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    32-6556-41

    32-6556-41

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,376
    32-6556-41

    规格书

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    124-PGM13008-41

    124-PGM13008-41

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,805
    124-PGM13008-41

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-6553-16

    24-6553-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    2,899
    24-6553-16

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6556-40

    36-6556-40

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    2,078
    36-6556-40

    规格书

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    APH-1440-G-T

    APH-1440-G-T

    APH-1440-G-T

    Samtec Inc.

    4,694
    APH-1440-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1940-G-T

    APH-1940-G-T

    APH-1940-G-T

    Samtec Inc.

    4,236
    APH-1940-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1540-G-T

    APH-1540-G-T

    APH-1540-G-T

    Samtec Inc.

    2,100
    APH-1540-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1040-G-T

    APH-1040-G-T

    APH-1040-G-T

    Samtec Inc.

    4,794
    APH-1040-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0240-G-T

    APH-0240-G-T

    APH-0240-G-T

    Samtec Inc.

    4,669
    APH-0240-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0340-G-T

    APH-0340-G-T

    APH-0340-G-T

    Samtec Inc.

    3,962
    APH-0340-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1240-G-T

    APH-1240-G-T

    APH-1240-G-T

    Samtec Inc.

    4,805
    APH-1240-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1640-G-T

    APH-1640-G-T

    APH-1640-G-T

    Samtec Inc.

    3,138
    APH-1640-G-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    550-10-432M31-001166

    550-10-432M31-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    4,278
    550-10-432M31-001166

    规格书

    550 Bulk Active BGA 432 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    192-PGM17025-11

    192-PGM17025-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,975
    192-PGM17025-11

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    546-87-463-19-101147

    546-87-463-19-101147

    CONN SOCKET PGA 463POS GOLD

    Preci-Dip

    1,042
    546-87-463-19-101147

    规格书

    546 Bulk Active PGA 463 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-299-20-001112

    614-83-299-20-001112

    CONN SOCKET PGA 299POS GOLD

    Preci-Dip

    3,284
    614-83-299-20-001112

    规格书

    614 Bulk Active PGA 299 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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