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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    116-83-422-41-009101

    116-83-422-41-009101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    3,467
    116-83-422-41-009101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-628-41-007101

    116-87-628-41-007101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    1,669
    116-87-628-41-007101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-428-41-036101

    146-87-428-41-036101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,947
    146-87-428-41-036101

    规格书

    146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-314-ZWTT-3

    ICA-314-ZWTT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,728
    ICA-314-ZWTT-3

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    10-9513-10T

    10-9513-10T

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    1,797
    10-9513-10T

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    C8122-04

    C8122-04

    CONN IC DIP SOCKET 22POS TIN

    Aries Electronics

    3,804
    C8122-04

    规格书

    Edge-Grip™, C81 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    34-3513-10

    34-3513-10

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    4,627
    34-3513-10

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-0513-10H

    20-0513-10H

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    2,723
    20-0513-10H

    规格书

    0513 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-3518-00

    24-3518-00

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,734
    24-3518-00

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-432-41-007101

    116-87-432-41-007101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,504
    116-87-432-41-007101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-085-10-031101

    510-87-085-10-031101

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    1,317
    510-87-085-10-031101

    规格书

    510 Bulk Active PGA 85 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    40-1518-10

    40-1518-10

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,075
    40-1518-10

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    APA-308-T-P

    APA-308-T-P

    ADAPTER PLUG

    Samtec Inc.

    3,423
    APA-308-T-P

    规格书

    APA Tube Active - 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICA-314-ZWTT-2

    ICA-314-ZWTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,891
    ICA-314-ZWTT-2

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    AR 48-HZL/07-TT

    AR 48-HZL/07-TT

    CONN IC DIP SOCKET 48POS GOLD

    Assmann WSW Components

    4,187
    AR 48-HZL/07-TT

    规格书

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    110-83-642-41-005101

    110-83-642-41-005101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    4,264
    110-83-642-41-005101

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-6513-10

    28-6513-10

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,759
    28-6513-10

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-83-428-41-006101

    116-83-428-41-006101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    1,003
    116-83-428-41-006101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    08-2513-11H

    08-2513-11H

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,740
    08-2513-11H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    29-0518-10

    29-0518-10

    CONN SOCKET SIP 29POS GOLD

    Aries Electronics

    3,689
    29-0518-10

    规格书

    518 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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