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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    ICO-632-ZMGT

    ICO-632-ZMGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,610
    ICO-632-ZMGT

    规格书

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    510-83-172-16-001101

    510-83-172-16-001101

    CONN SOCKET PGA 172POS GOLD

    Preci-Dip

    1,510
    510-83-172-16-001101

    规格书

    510 Bulk Active PGA 172 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-156-15-061101

    510-83-156-15-061101

    CONN SOCKET PGA 156POS GOLD

    Preci-Dip

    1,720
    510-83-156-15-061101

    规格书

    510 Bulk Active PGA 156 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-156-15-062101

    510-83-156-15-062101

    CONN SOCKET PGA 156POS GOLD

    Preci-Dip

    3,073
    510-83-156-15-062101

    规格书

    510 Bulk Active PGA 156 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0218-T-22

    HLS-0218-T-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,203
    HLS-0218-T-22

    规格书

    HLS Tube Active SIP 36 (2 x 18) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    14-0508-21

    14-0508-21

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    3,797
    14-0508-21

    规格书

    508 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    14-0508-31

    14-0508-31

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    2,375
    14-0508-31

    规格书

    508 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    27-0508-20

    27-0508-20

    CONN SOCKET SIP 27POS GOLD

    Aries Electronics

    3,485
    27-0508-20

    规格书

    508 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    27-0508-30

    27-0508-30

    CONN SOCKET SIP 27POS GOLD

    Aries Electronics

    1,300
    27-0508-30

    规格书

    508 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    20-3508-201

    20-3508-201

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,048
    20-3508-201

    规格书

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-3508-301

    20-3508-301

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,340
    20-3508-301

    规格书

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    21-0508-30

    21-0508-30

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    1,557
    21-0508-30

    规格书

    508 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    APO-624-T-R

    APO-624-T-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,765
    APO-624-T-R

    规格书

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-324-T-R

    APO-324-T-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,153
    APO-324-T-R

    规格书

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    24-3503-20

    24-3503-20

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    1,471
    24-3503-20

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-1508-21

    14-1508-21

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,898
    14-1508-21

    规格书

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    14-1508-31

    14-1508-31

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    1,076
    14-1508-31

    规格书

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    116-83-650-41-011101

    116-83-650-41-011101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    3,688
    116-83-650-41-011101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    11-0501-20

    11-0501-20

    CONN SOCKET SIP 11POS TIN

    Aries Electronics

    2,213
    11-0501-20

    规格书

    501 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    11-0501-30

    11-0501-30

    CONN SOCKET SIP 11POS TIN

    Aries Electronics

    3,002
    11-0501-30

    规格书

    501 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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